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Home > About IEEE > Awards > Bios
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Executive Director, Institute of Microelectronics, Singapore Sience Park II, Singapore

The leadership and strategic vision of John E. Kelly III has led IBM to major technology breakthroughs and partnerships. Among the many innovations developed under Dr. Kelly’s guidance, IBM introduced “copper back end of line,” rolled out 300-nanometer wafer scale and brought silicon-on-insulator technology to the high-performance microprocessor market. His unification efforts within IBM streamlined the process of bringing research and development concepts to manufacturing and commercialization. Dr. Kelly’s passion for semiconductor technology was also instrumental in creating an industry–public sector alliance that resulted in the Center of Excellence in Nanoelectronics and Nanotechnology and the NanoTech Complex at the College of Nanoscale Science and Engineering in Albany, N.Y. The NanoTech Complex is a first-of-its-kind education paradigm providing unique opportunities for students while supporting the workforce needs of the semiconductor industry.
An IEEE Fellow, Dr. Kelly is currently senior vice president and director of research at IBM Research, Yorktown Heights, N.Y.

Shojiro Asai’s contributions in electron device technologies helped position Hitachi Ltd. as a leader in the semiconductor field and benefited the industry as a whole. Dr. Asai was a leader in the development of sub-micon MOS devices. The 2-D numerical simulator for carrier transport his team built for this purpose was a world benchmark during the 1970s. He was instrumental in the development of electron beam mask making and direct writing, now indispensible tools for semiconductor manufacturing. He also led the efforts in dynamic random access memories with 3-D memory cells and microcontrollers with embedded nonvolatile memories and digital signal processor capabilities. These are now key components in computers, cell phones and personal navigators.
Dr. Asai was a key leader in developing low-cost, tamper-resistant radio frequency identification (RF-ID) technology. It provides the ability to trace industrial and commercial goods throughout the entire product lifecycle. An IEEE Life Fellow, Dr. Asai is currently executive vice president of Rigaku Corporation, Tokyo, Japan.

Gilbert J. Declerck, co-founder, president and CEO of the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium, is credited with developing IMEC into one of the world’s most advanced semiconductor research centers. Under his guidance, IMEC has created a unique alliance with the top integrated device manufacturers, foundries, system houses, fables and fab-lite companies and researchers in academia and industry. Dr. Declerck’s leadership has continued the expansion of IMEC’s R&D capabilities into cutting edge transistor scaling beyond the 32nm node. Today IMEC is recognized worldwide and runs several industrial affiliation programs with global participation in the fields of semiconductor technology, system-on-chip design, heterogeneous integration and advanced packaging technologies. Dr. Declerck’s success in bringing together preeminent researchers in semiconductors and other fields, including nanotechnology, has earned him numerous appointments to several advisory boards of scientific organizations and companies. An IEEE Fellow, Dr. Declerck has authored and co-authored more than 200 papers.

Kenneth Lee is senior advisor and former president and chief executive officer of KT Corporation (Korea Telecom) in Seoul, Korea, and a visiting professor at the KAIST Graduate School of Information and Media Management, Seoul, Korea.
KT Group developed one of the most extensive wired and wireless broadband access networks in the world and the world’s largest broadband operator by 2003 with over five million subscribers. He also led KT to develop the first Korean voice recognition system, the first commercial CDMA Personal Communications System and a series of broadband access services from DSL to fiber LAN.
When Dr. Lee was the CEO of KTF, a mobile service subsidiary of KT Corp., he was the industry leader in CDMA 3G services by deploying CDMA2000 1x and CDMA2000 1xEV-DO in 2002 — enabling high-speed wireless connectivity comparable to wired broadband.
Dr. Lee is an IEEE Member and a member of Eta Kappa Nu and the National Academy of Engineering in Korea. He received the Industrial Medal (Gold) from the Korean Government in 2005 and the Forbes Magazine’s Management Leadership Award in 2004.

Louis C. Parrillo is an exceptional technical and business leader with the vision to lead technology companies in important new and strategic directions..
At Bell Laboratories in Murray Hill, NJ, Dr. Parrillo and his colleagues developed the company’s first all-implanted, high-speed bipolar technology, including solutions to yield-limiting mechanisms that the industry widely adopted. With Dr. Richard Payne, he developed Twin Tub CMOS technology, which produced the world’s first 32-bit CMOS microprocessor. The original and subsequent generations of Twin Tub CMOS became an industry standard for high performance CMOS.
As leader of Motorola’s Advanced Products Research and Development Lab (APRDL) in Austin, Texas he pursued his vision of creating a mini Bell Labs in a business environment by strengthening the organization technically and linking its activities to the businesses and manufacturing.
Working with TRW, he led Motorola’s efforts to produce the world’s largest and most advanced Superchips, successfully completing the U. S. Government’s CMOS Very High Speed Integrated Circuit (VHSIC) program.
He drove the creation of Motorola’s Dan Noble Center, enabling the company to make leading-edge Power-PC products and laying the groundwork for several external technology alliances. As a division general manager he drove the development and market introduction of ultra-fast SRAM products, at the time the fastest and most compact, as well as the first to use copper interconnect technology.
As Semiconductor CTO, he and his colleagues led the partnership among Motorola, ST Microelectronics, Philips Semiconductor and TSMC for 300mm-wafer research in Crolles, France . Such a partnership lowered the cost and risk of 300mm technology development, enabling Motorola with ongoing, technological advances to benefit their customers worldwide.
Dr. Parrillo retired in 2003 from Motorola and is now president of Parrillo Consulting, LLC in Austin, Texas, where he provides technical, managerial and business expertise to a diverse group of clients.
An IEEE Fellow, he is a past president of the IEEE Electron Devices Society, received the society’s J.J.Ebers Award and is a member of the National Academy of Engineering. He has a bachelor’s degree from the University of Connecticut at Storrs in electrical engineering, and a master of arts, a master’s in electrical engineering and a doctoral degree in electrical engineering, all from Princeton University.
A long-time pioneer in the field of semiconductor research and development, Dr. Hiroyoshi Komiya has played a critical role in building the basic technology of the semiconductor industry worldwide. He is an international leader in developing ultra-large-scale integration (ULSI) technology and its standards including 300mm technology, ArF and EB lithography. As both chairman of the Asia Task Force of the Silicon Wafer Summit and executive vice president and chief operating officer of Semiconductor Leading Edge Technologies, Inc. in Tsukuba, Japan, Dr. Komiya drove key decisions about next generation wafer size and global collaboration strategies for the transition. Dr. Komiya subsequently led cooperative research and development expected to make a significant contribution to the progress of semiconductor technology in the sub-100nm range.
An IEEE Fellow and a recipient of the IEEE Third Millennium Medal, he has served on the executive committee of the IEEE Tokyo Section.
A longtime trailblazer in the field of microprocessors, Dr. Youssef A. El-Mansy has led the way in developing innovative yet manufacturable technologies. Thanks to his pioneering leadership, first as group vice president and now as corporate vice president and director of logic technology development, Intel has risen to the top of its field and the semiconductor technology cycle has accelerated from three years to two. Since he joined Intel Corporation, Hillsboro, Oregon in 1979, Dr. El-Mansy has led the development of logic technology from the 1-micron through 0.065 micron generation. He is primarily responsible for the "copy exactly" methodology, which enables high-yielding production ramps of new semiconductor processes at multiple sites at unprecedented rates.
An IEEE Fellow, Dr. El-Mansy has served the IEEE Electron Devices Society (EDS) on numerous committees and currently serves on the EDS VLSI Symposia Executive Committee. He has published over 30 papers.
During his 36-year tenure with British Telecom (BT) laboratories, visionary Thomas R. Rowbotham led many breakthroughs-encoded TV signals over microwave radio and satellite-switched TDMA, Blown Fiber, the semiconductor laser amplifier, the add-drop digital multiplexer at 2.4 Gbit/s, the 565 Mbit/s optical transmission system, the longest transmission between repeaters over fiber (200 kms), as recognized by the Guinness Book of World Records, and global virtual network service. As director of BT Laboratories, he began an outreach program, promoting stronger collaboration and communication among competing telecommunications laboratories around the world. Subsequently, many multi-company initiatives in the fields of open networks and local loop technology were created.
An IEEE Senior Member, Dr. Rowbotham has served as IEEE Division III (Communications Technology) director and on the IEEE Communications Society and IEEE Foundation boards. He is a Fellow of the IEE and the Royal Academy of Engineering, and is a venture partner with St. Paul Venture Capital in Westboro, Mass.
Dr. Toshiharu Aoki, president and CEO of NTT Data Corporation, has helped to shape the integrated digital network in Japan through major communications developments, including coding theory, digital-over-analog transmission systems and switching systems. He also has led the Telecommunication Information Networking Architecture Consortium, a global research and development group; the Full Service Access Network, an international fiber optic access standards body; and many efforts that have pioneered the development of multimedia services in Japan. He is an IEEE and Institute of Electronics, Information and Communications Engineers (IEICE) Fellow. Dr. Aoki has served as president of IEICE and on the Industry Technology Committee of the Japan Federation of Economic Organizations.
His honors include the Post & Telecom Association of Japan’s Maejima Award, the IEICE Achievement Award and the IEICE Yonezawa Memorial Young Engineer Award.