IEEE Components, Packaging, and Manufacturing Technology Award (CPMT)

The IEEE CPMT Award was established in 2002.

Recipient selection is administered through the Technical Field Awards Council of the IEEE Awards Board.

Sponsor:  IEEE Components, Packaging, and Manufacturing Technology Society

Presented to: An individual or a team of not more than three

Scope: For meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies

Prize: The award consists of a bronze medal, certificate, and honorarium.

Basis for judging: In the evaluation process, the following criteria are considered: enhancement of technology, impact on the relevant technical community and the profession, benefit to society, and the quality of the nomination. The technical field for this award includes all aspects of device and systems packaging, including packaging of microelectronics, optoelectronics, RF/wireless, and micro-electro-mechanical systems (MEMS.)

Nomination deadline: 31 January

Presentation:  IEEE policy requires that its awards be presented at major IEEE events that are in keeping with the nature of the award and the cited achievement.

• Robert C. Pfahl, Jr., Chair
• John W. Stafford, Past Chair
• Rolf Aschenbrenner
• Eric Beyne
• Bill Chen
• Evan E. Davidson
• Patrick Thompson