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Home  >  Conferences & Events  >  Conference Details

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

Premier components, packaging and technology

 

Conference Details

Dates

27 May - 30 May 2014

 

Location

Walt Disney Swan & Dolphin
Orlando, FL, USA

 

Web site

 

Contact

Patrick Thompson - Finance Chair
Texas Instruments, Inc.
3621
13020 TI Blvd
Dallas TX USA 75243
+1 214 567 0660
patrick.thompson@ti.com

 

Conference #

20239

 

Attendance

900

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 14 Oct 2013

Final submission deadline: 25 Feb 2014

Notification of acceptance date: 09 Nov 2013

 

 

Features

  • Exhibits
  • Tutorials