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2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

The EDAPS involves modeling, simulation, and measurement for the electrical design issues on chip, package and system levels. It will not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, EDA tools, and next generation 3D ICs.

 

Conference Details

Dates

09 Dec - 11 Dec 2012

 

Location

Howard International House
Taipei, Taiwan

 

Web site

 

Contact

Guo-sheng Tzeng
No. 1, Sec. 4, Roosevelt Road
Taipei Taiwan 10617
+886 2 23628136
tgsjames@tl.ntu.edu.tw

 

Conference #

20413

 

Attendance

150

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 01 Sep 2012

Final submission deadline: 31 Oct 2012

Notification of acceptance date: 05 Oct 2012

 

 

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