The EDAPS involves modeling, simulation, and measurement for the electrical design issues on chip, package and system levels. It will not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, EDA tools, and next generation 3D ICs.
09 Dec - 11 Dec 2012
Howard International House
No. 1, Sec. 4, Roosevelt Road
Taipei Taiwan 10617
+886 2 23628136
Please see the conference Web site for full details.
Abstract submission deadline: 01 Sep 2012
Final submission deadline: 31 Oct 2012
Notification of acceptance date: 05 Oct 2012