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2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Sponsored by:
- Components, Packaging and Manufacturing Technology Society - CPMT
The EDAPS involves modeling, simulation, and measurement for the electrical design issues on chip, package and system levels. It will not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, EDA tools, and next generation 3D ICs.
Conference Details
Dates
09 Dec - 11 Dec 2012
Location
Howard International House
Taipei, Taiwan
Web site
Contact
Guo-sheng Tzeng
No. 1, Sec. 4, Roosevelt Road
Taiwan Taipei 10617
+886 2 23628136
tgsjames@tl.ntu.edu.tw
Conference #
20413
Attendance
150
Publications
Please see the conference Web site for full details.
Call for Papers for Conference Authors
Find details for paper and abstract submission.Abstract submission deadline: 01 Sep 2012
Final submission deadline: 31 Oct 2012
Notification of acceptance date: 05 Oct 2012
Conference Focus
- Application
- Science
