To promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages.
13 Dec - 16 Dec 2012
Novotel Hong Kong Citygate
51 Man Tung Road
Tung Chung , Hong Kong
Hong Kong University of Science and Technology
Kowloon Hong Kong 99999
Please see the conference Web site for full details.
Abstract submission deadline: 10 Aug 2012
Final submission deadline: 20 Nov 2012
Notification of acceptance date: 15 Sep 2012