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2012 14th International Conference on Electronic Materials and Packaging (EMAP)
Sponsored by:
- Components, Packaging and Manufacturing Technology Society - CPMT
- Hong Kong Section CPMT Chapter
To promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages.
Conference Details
Dates
13 Dec - 16 Dec 2012
Location
Novotel Hong Kong Citygate 51
Lantau Island, Hong Kong
Web site
Contact
Zheming Zhang
Hong Kong University of Science and Technology
HK Kowloon 99999
+852-23588444
+852-23581543 (fax)
emap2012s@ust.hk
Conference #
30077
Attendance
200
Please see the conference Web site for full details.
Call for Papers for Conference Authors
Find details for paper and abstract submission.Abstract submission deadline: 10 Aug 2012
Final submission deadline: 20 Nov 2012
Notification of acceptance date: 15 Sep 2012
