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2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM)

Materials and processes for packaging the whole range of electronic and optoelectronic products.

 

Conference Details

Dates

27 Feb - 01 Mar 2013

 

Location

Atrium Hotel
tbd
Irvine, CA, USA

 

Web site

 

Contact

Sam Karikalan
Broadcom
Irvine CA USA 99999
samk@broadcom.com

 

Conference #

30542

 

Attendance

200

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 15 Dec 2012

Final submission deadline: 15 Jan 2013

Notification of acceptance date: 31 Dec 2012

 

 

Features

  • Exhibits