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Home  >  Conferences & Events  >  Conference Details

2013 e-Manufacturing & Design Collaboration Symposium (eMDC)

IEEE sponsors:

  • IEEE Electron Devices Society

Other sponsors:

  • Taiwan Semiconductor Industry Association - TSIA

The Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up -to-date experiences.

 

Conference Details

Dates

06 Sep - 06 Sep 2013

 

Location

The Ambassador Hotel Hsinchu
Hsinchu
Hsinchu, Taiwan

 

Web site

 

Contact

Celia Shih
Rm1246, Bldg 51, 195, Sec. 4 Chung Hsing Rd., Chutung,
HsinChu Taiwan 310
+886 3 5917092
celia@tsia.org.tw
+886-3-5820056 (fax)

 

Conference #

31329

 

Attendance

180

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 31 May 2013

Final submission deadline: 31 Jul 2013

Notification of acceptance date: 01 Jul 2013