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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

Other sponsors:

  • Wroclaw University of Technology

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems.

 

Conference Details

Dates

14 Apr - 17 Apr 2013

 

Location

Haston City Hotel
ul. Irysowa 1-3
Wroclaw, Poland

 

Web site

 

Contact

OlivierDe Saint Leger
ASTEFO
sarl 12 rue Signac
Voisins le Bretonneux France 9999
+3301 3043 6388
olivier.desaintleger@astefo.com

 

Conference #

31461

 

Attendance

200

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 15 Nov 2012

Final submission deadline: 15 Mar 2013

Notification of acceptance date: 18 Dec 2012

 

 

Features

  • Exhibits
  • Tutorials