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2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Sponsored by:
- Components, Packaging and Manufacturing Technology Society - CPMT
EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems.
Conference Details
Dates
14 Apr - 17 Apr 2013
Location
Haston City Hotel ul. Irysowa
Wroclaw, Poland
Web site
Contact
Olivier De Saint Leger
ASTEFO
sarl 12 rue Signac
FR Voisins le Bretonneux 9999
+3301 3043 6388
olivier.desaintleger@astefo.com
Conference #
31461
Attendance
200
Please see the conference Web site for full details.
Call for Papers for Conference Authors
Find details for paper and abstract submission.Abstract submission deadline: 15 Nov 2012
Final submission deadline: 15 Mar 2013
Notification of acceptance date: 18 Dec 2012
