ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.
26 May - 29 May 2015
Sheraton San Diego Hotel & Marina
1380 Harbor Island Dr
San Diego, CA, USA
Texas Instruments Inc
13020 TI Blvd
Dallas TX USA 75243
Please see the conference Web site for full details.
Abstract submission deadline: 13 Oct 2014
Final submission deadline: 25 Feb 2015
Notification of acceptance date: 13 Dec 2014