Skip Navigation
Join IEEE
 
 

Home  >  Conferences  >  Conference Details

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

 

Conference Details

Dates

26 May - 29 May 2015

 

Location

Sheraton San Diego Hotel & Marina
1380 Harbor Island Dr
San Diego, CA, USA

 

Web site

 

Contact

Patrick Thompson
Texas Instruments Inc
3621
13020 TI Blvd
Dallas TX USA 75243
+1-214-567-0660
patrick.thompson@ti.com

 

Conference #

32613

 

Attendance

1000

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 13 Oct 2014

Final submission deadline: 25 Feb 2015

Notification of acceptance date: 13 Dec 2014

 

 

Features

  • Exhibits
  • Tutorials