Skip Navigation
Join IEEE
 
 

Home  >  Conferences  >  Conference Details

2021 IEEE 71st Electronic Components and Technologies Conference (ECTC)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

ECTC is the premier international conference sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. ECTC papers comprise a wide spectrum of topics, including 3D packaging, electronic components, materials, assembly, interconnections, device and system packaging, optoelectronics, reliability, and simulation.

 

Conference Details

Dates

01 Jun - 04 Jun 2021

 

Location

Sheraton San diego Hotel & Marina
1380 Harbor Island Drive
San Diego, CA, USA

 

Web site

 

Contact

Patrick Thompson
Texas Instrument Inc
3261
13020 TI Blvd
Dallas TX USA 75243
+1 214 567-0660
patrick.thompson@ti.com

 

Conference #

32696

 

Attendance

1000

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 16 Oct 2020

Final submission deadline: 12 Feb 2021

Notification of acceptance date: 11 Dec 2020

 

 

Features

  • Exhibits
  • Tutorials