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2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

ITherm 2014 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems.

 

Conference Details

Dates

27 May - 30 May 2014

 

Location

Walt Disney World Swan & Dolphin Hotel
Orlando, FL, USA

 

Web site

 

Contact

Paul Wesling
SF Bay Area Council, IEEE
PO Box 2110
Cupertino CA USA 95015-2110
408-331-0114
p.wesling@ieee.org

 

Conference #

32908

 

Attendance

300

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 15 Sep 2013

Final submission deadline: 01 Mar 2014

Notification of acceptance date: 30 Sep 2013

 

 

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