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2013 3rd Annual Global Interposer Technology Workshop (GIT)

Other sponsors:

  • Georgia Institute of Technology

GIT 2013 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. IEEE GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive, and high performance systems.


Conference Details


17 Nov - 20 Nov 2013



Georgia Institute of Technology
Global Learning Center
84 Fifth Street, NW
Atlanta, GA, USA


Web site



Karen May
Georgia Institute of Technology
Atlanta GA USA +1 404 385-1220


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Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 23 Sep 2013

Final submission deadline: 28 Oct 2013

Notification of acceptance date: 01 Oct 2013