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2013 3rd Annual Global Interposer Technology Workshop (GIT)

IEEE sponsors:

  • IEEE Components, Packaging and Manufacturing Technology Society

Other sponsors:

  • Georgia Institute of Technology

GIT 2013 Workshop is intended to stimulate development of most advanced semiconductor and systems packaging technologies, comparing and contrasting a wide variety of interposer and package technologies being developed such as silicon, organic, and glass. IEEE GIT 2013 brings together academic and industry researchers from end-users, device manufacturers, interposer substrate manufacturers and supply chain companies that supply materials and tools from around the world. Such interposer and package technologies have many applications including packaging of ICs in 2D, 2.5D and 3D from smart phones, automotive, and high performance systems.

 

Conference Details

Dates

17 Nov - 20 Nov 2013

 

Location

Georgia Institute of Technology
Global Learning Center
84 Fifth Street, NW
Atlanta, GA, USA

 

Web site

 

Contact

KarenMay
Georgia Institute of Technology
Atlanta GA USA +1 404 385-1220
karen.may@prc.gatech.edu

 

Conference #

33084

 

Attendance

200

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 23 Sep 2013

Final submission deadline: 28 Oct 2013

Notification of acceptance date: 01 Oct 2013