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16th INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS
Suzhou International Expo Center, Suzhou
06-10 July, 2009
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Welcome to IPFA 2009 Home Page
The 16th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2009) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter in co-operation with IEEE Nanjing Section in China. The Symposium is technically co-sponsored by the IEEE Electron Device Society, IEEE Reliability Society.
IPFA 2009 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.
In a paper exchange arrangement with ESREF and ISTFA, the Best Papers from ESREF 2007 and ISTFA 2007 will be presented at IPFA 2008, while the best oral papers in reliability and failure analysis from IPFA 2008 will be presented at the corresponding conferences.
We look forward to your continued support in IPFA 2009.
IPFA 2009 Organising Committee
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