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Description

Promotes graduate-level study and research on electronic packaging.

 
 

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Prize

US$21,100 per year. Of this sum US$9,100 is intended to assist the student with tuition, fees, and books; US$12,000 is to be paid in periodic installments to match the school enrollment terms (usually nine months); complimentary membership in IEEE and CPMT for term of Fellowship.

 
 

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Eligibility

Must have completed a minimum of four years of college plus one year of graduate study in a recognized scientific or engineering curriculum; must be enrolled full-time in a graduate curriculum leading to a Ph.D., with electronic packaging as a major field of interest.

 
 

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Basis for Judging

Student Paper competition conducted during Electronic Components and Technology Conference (ECTC) in May or June. Abstracts must be submitted to ECTC Program committee with request to be considered for Fellowship competition.

 
 

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Presentation

Annual Electronic Components and Technology Conference.

 
 

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Annual Electronic Components and Technology Conference.

October

 
 

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Contact

IEEE Components, Packaging and Manufacturing Technology Society
445 Hoes Lane, PO Box 1331
Piscataway, NJ 08855-1331 USA

Phone: + 1 732 562 5529

Fax: +1 732 981 1769

Email: m.tickman@ieee.org

 
 

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