2003 IEEE International Reliability Physics Symposium (IRPS)

 

The International Reliability Physics Symposium (IRPS), the premier symposium for the scientific exploration of microelectronic reliability will be accepting papers for the 2003 IRPS from March 30 through April 3, 2003 at the Hyatt Regency Hotel in Dallas, Texas. Submission deadline is October 1, 2002 with an extended deadline in December. This year, the IRPS will feature special presentations by the following individuals:

  • Shiang-yi Chiang, TSMC, Sr. VP of R&D will speak on Foundry Reliability and Technology
  • Mark Bohr, Intel Fellow and Director of Process Architecture will speak on IDM Reliability and Technology
  • Larry Hornbeck, Texas Instruments Fellow, Digital Light Processing will speak on the future of MEMs based projection display systems.

For the past 40 years, IRPS has been one of the leading meetings for engineers in the area of electronic component reliability. IRPS promotes the comprehension of reliability and performance of integrated circuits and microelectronic assemblies through an improved understanding of failure mechanisms in the user’s environment. Originally started in the early 1960’s by the military and aerospace community, IRPS is now sponsored by IEEE Reliability Society and IEEE Electron Devices Society.

“Along with providing the latest reliability findings, this symposium also offers a unique opportunity for attendees to meet with peers, discuss the most up-to-date industry information and share advice and expertise with others,” says IRPS 2003 General Chair Eric Snyder. “Those presenting a paper will have the opportunity to provide valuable information to attendees, through their lecture and subsequent discussions.”

This year, the conference will emphasize the most recent developments in reliability for the following areas: High-k gate dielectrics; dual gate devices; Low-k and Cu; NBTI; SOI; Foundry Reliability as well as Product Reliability and Burn-in; Non-Volatile Memory; Qualification Strategies; Assembly and Packaging; Failure Analysis; MEMS; Device Dielectrics; Interconnects; Transistor; Process Induced Damage; Device and Process; ESD and Latch-up.

The IRPS planning committee has agreed to accept paper submissions of both draft papers and abstracts. Draft paper submissions are unrestricted in length and may represent the final manuscript. Abstract submissions should include sufficient information to indicate the path of development for the final paper. Due to the success of last year’s poster session, submissions are once again being accepted. Posters, limited to two pages, are presented at a special reception, specifically designed for the display and discussion of this work. For further information about the conference and submission guidelines visit www.irps.org or contact the session chair:

Eric S. Snyder
Sandia Technologies, Inc
Albuquerque, NM, USA