IEDM Short Courses on Videotape

The 2000 IEEE International Electron Devices Meeting was held this past year in San Francisco, CA. The two short courses that were offered at this meeting were titled “Advanced Interconnects: Design, Process, and Integration” and “Technology for the Internet Era.” These short courses are now available on videotape to purchase through IEEE Customer Service.

Advanced Interconnects: Design, Process, and Integration

Presented by Jim Ryan, IBM; Scott Wills, Georgia Institute of Technology; Ron Goldblatt, IBM; Karen Maex, IMEC; T.R. Yew, UMC; Anthony Oates, Agere Systems.

As technologies scales to the 0.13 µm generation and below, interconnect performance is an increasingly large factor to consider in high-performance and low-power chip designs. To improve interconnect performance at the same pace as transistor performance, revolutionary changes in the material systems are required. However, there are significant challenges associated with the introduction of new materials into a manufacturing environment. This course will describe the materials, process, manufacturing, and design trends in interconnect technology with a focus on copper and low-K interconnect systems.

The first lecture will cover interconnect trends and chip design issues and how they influence the selection of the interconnect architecture. The second lecture will present an overview of the materials and process issues for copper and low-K materials focusing on the evolution of the materials systems over time. The third lecture will describe unique integration issues surrounding copper and low-K. The fourth lecture will discuss the manufacturing issues including defect monitoring and parameter control at the sector level. Finally, interconnect reliability issues will be covered contrasting the failure modes in Aluminum to Copper.

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Technology for the Internet Era

Presented by Sam Shichijo, Texas Instruments Inc.; Mike McMahan, Texas Instruments Inc.; Walter Y. Chen, Scenix; Anantha Chandrakasan, MIT; Akira Matsuzawa, Matsushita Electric; Joachim Burghartz, Delft University of Technology.

The new millennium marks the beginning of the Internet era. With the proliferation of high speed and portable Internet access devices such as cellular phone, PDA, cable modem and DSL, ubiquitous, high speed Internet access is becoming a reality. In the PC era of the ’80’s and ’90’s, microprocessor and memory were the components that drove growth of the PC industry. In this Internet era, DSP and analog/mixed signals circuits will be the components that drive the growth in Internet products. The field of Internet access systems is very diverse, ranging from wireless cellular phones to wired broadband access devices with correspondingly diverse circuit and device requirements. This course will explore the key components of both wireless and wired Internet access systems and the implications on device technology. The course starts with system overviews and then discusses the corresponding circuit and device technology.

The first lecture describes the system overview of wireless systems including cellular, satellite and short distance applications. The second lecture addresses the wired systems for broadband access and home network applications. The third lecture presents the issues of low power system and circuit design for networked applications. The fourth lecture deals with the mixed signal circuit design for System-on-Chip. The final lecture discusses the RF technology issues for both wireless and wired system applications. Order information:

Here’s how to place your order for the two IEDM videos:
Tel: (800) 678-4333 (in the USA or Canada) or (732) 981-0060 Fax: (732) 981-9667
www: http://shop.ieee.org/store
E-Mail: customer.service@ieee.org

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