| Paul
E. Dodd was born in Cleveland, Ohio in 1966, and grew up in Bloomington,
Indiana. In 1984 he entered Purdue University in West Lafayette, Indiana,
where he earned a B.S. degree in Electrical Engineering "with
highest distinction" in 1988. He was awarded a Purdue University
Fellowship and began graduate research in 1988, working with thesis
advisor Dr. Mark Lundstrom in the area of numerical simulation of
heterojunction bipolar transistors (HBTs). After receiving his M.S.E.E.
degree in 1989, Paul continued his graduate research at Purdue, this
time applying numerical modeling techniques, experimental process
fabrication development, and electrical characterization to the study
of high-performance compound semiconductor bipolar transistors. In
1993 Paul completed his doctoral research and received the Ph.D. degree
in Electrical Engineering from Purdue University.
Paul joined Sandia National Laboratories in
1993 as a postdoctoral researcher in the Radiation Technology and
Assurance department led by Peter Winokur, and became a Senior Member
of Technical Staff in the department in 1994. Since arriving at
Sandia, Paul has performed leading-edge research to expand the understanding
of the fundamental physics behind ion-induced charge collection
and single-event upset (SEU) in microelectronics. He was among the
first in the radiation effects community to apply full three-dimensional
(3D) device simulation to studying single-event effects. His numerical
studies of the physical mechanisms involved in single-event effects
have encompassed the effects of circuit loading on SEU, the effect
of ion energy on SEU, and the impact of technology trends on SEU
to determine if new failure mechanisms will beset future electronics.
Paul has consistently been an advocate for the importance of code
validation, which has led to the development and use of innovative
experimental techniques such as time-resolved ion- beam-induced
charge collection using focused ion microbeams. To further push
the limits of single-event upset simulation, Paul developed and
used a customized version of a mixed-level device/circuit simulator
to directly calculate upset maps and cross section curves in CMOS
integrated circuits (ICs). These pioneering simulations enabled
vastly improved validation against experimental data, and are a
step toward the ability to simulate the response of entire circuits
rather than just a few transistors. The simulations also provided
basic physical insight into the shape of the upset cross-section
curve used to calculate mission error rates for ICs operating in
the natural space environment.
Paul is a core member of the team at Sandia responsible
for developing radiation-hardened CMOS process technologies. His
development of validated and predictive models for radiation effects
is a crucial part of Sandia's strategy for meeting technical and
programmatic goals for radiation-hardened CMOS technologies. These
simulations allow the optimization of both process and design parameters
in order to maximize performance and manufacturability prior to
obtaining first silicon and are advancing the state-of-the-art in
radiation-hardened microelectronics. Recently, Paul's research has
focused on radiation effects in silicon-on-insulator (SOI) technologies.
He was a co-inventor of the BUSFET, a patented body-tied SOI transistor
structure that is designed to be total-dose hard without the need
for specially-hardened SOI substrates. Paul has explored the performance
of SOI devices in heavy ion environments using a powerful combination
of focused ion microbeam experiments, 3D numerical simulations,
and broadbeam heavy ion accelerator testing. For example, his focused
ion microbeam experiments confirmed the presence of ion-induced
snapback in single-transistor SOI test structures, and found that
the drain voltage required for snapback to occur was the same whether
snapback was initiated electrically or using heavy ions. This important
result implied that electrical testing may be an accurate screen
for ion-induced snapback, and also that commercial SOI circuits
not specifically designed for space environments may not exhibit
snapback because they must be designed to operate reliably during
electrical stimulation. Paul also recently discovered a new charge-collection
mechanism in SOI devices that can lead to much larger than expected
SEU-sensitive volumes in SOI ICs. This mechanism may increase the
SEU-sensitive area (and hence the error rate) in some SOI ICs by
as much as a factor of ten, significantly decreasing the SEU advantages
of SOI ICs compared to their bulk silicon counterparts.
Paul has authored or co-authored more than 40 peer-reviewed
publications, including papers that won the 1997, 2000, and 2001
Nuclear and Space Radiation Effects Conference (NSREC) Outstanding
Conference Paper Awards. He is a Senior Member of the IEEE, and
a member of the Nuclear and Plasma Sciences and Electron Device
Societies. Paul has served the radiation effects community as Publicity
Chairman, Session Chairman, Awards Committee member, Short Course
Instructor, and Short Course Chairman for the IEEE NSREC, and has
been a Session Chairman for the Single-Event Effects Symposium and
the European RADECS Conference. He will serve as Technical Program
Chairman of the 2003 IEEE NSREC. Paul has also served the IEEE International
Electron Devices Meeting as a member of the Modeling and Simulation
Technical Subcommittee and Session Chairman.
Paul will receive his award at the 2002 IEEE NSREC
in Phoenix, Arizona. His citation reads: "For contributions
to the understanding and simulation of physical mechanisms responsible
for single-event effects in spaceborne microelectronics."
Paul E. Dodd is currently Technical Team Leader
for the Radiation Physics, Simulation, and Technology Department
at Sandia National Laboratories. He can be reached at Sandia National
Laboratories, P.O. Box 5800, MS-1083, Albuquerque, NM 87185-1083;
Phone: +1 505 844-1447; Fax: +1 505 844-2991; E-mail: pedodd@sandia.gov
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