Another IEEE Membership Benefit, Online Access to Transactions on Device and Materials Reliability

Started in 2001, this IEEE transaction (T-DMR) focuses on component reliability and documents the search for the root cause of failure in increasingly more complex devices and in the materials used to make these devices. The physics of failure, a watchword in the semiconductor industry, reveals new phenomenon that show up as weakness in design, process, material, or application. The determination and elimination of the root cause of failure invariably involves a multidisciplined effort. Electrical engineering, physics, materials, chemistry, processing, and packaging mix to generate a cost-effective solution.

This archival quarterly provides a new forum for information that has long been scattered as niche articles in publications and conference digests only partly aligned with one particular field or crossing the boundaries between disciplines. The scope covers the reliability of electronic, optical, magnetic, and MEMS devices, together with associated microsystems and packages. Because rapid dissemination of information is critical to the creation of high-reliability products, this transaction is available exclusively online and is free to all members to browse or read complete articles. T-DMR is sponsored by the IEEE Electron Devices Society and the IEEE Reliability Society (www.ieee.org/xploretdmr).

The December 2003 special issue focused on interface reliability. The March 2004 special issue will include selected and expanded papers from the 10th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2003). The September 2004 special issue will focus on Nonvolatile Memory Reliability. For more information concerning T-DMR and its EIC and editors, see www.ieee.org/tdmr/.