2002 International Conference on Microelectronics (MIEL 2002)

The International Conference on Microelectronics (MIEL) is a major European conference that provides an international forum for the presentation and discussion of the recent developments and future trends in the field of microelectronics. Since 1984, an aura of internationalization has surrounded the MIEL conference, providing an opportunity for specialists from both academic and industrial environments in the West and East, as well as from the countries of the Third World, to meet in an informal, friendly atmosphere and to exchange experiences in the theory and practice of microelectronics.

The 23rd MIEL will be held 12Ð15 May 2002 at the Faculty of Electronic Engineering, University of Nis, Yugoslavia. The topics to be covered include all important aspects of microelectronic devices, circuits and systems, technologies and devices, device physics and modeling, process and device simulation, circuit design and testing, system design and packaging, and characterization and reliability. Based on data from the conference over the past decade, MIEL 2002's program is expected to consist of about 150 contributed papers by the leading authorities from more than 30 countries, structured into oral and poster sessions, plus 15 invited papers. Two workshops, Power Devices and ICs and Microsystem Technologies, of six invited papers each, will round out the technical program of the conference.

Among the invited papers are:

• "Process-related reliability of gate dielectric for ULSI device," C.Y. Chang, National Chiao Tung University, Taiwan
• "Isolation issues in power integrated circuits," G. Charitat, LAAS-CNRS, France
• "SOI devices for 0.1 micron gate lengths," J.-P. Colinge, University of California, USA
• "Access to microsystem technology: The MPC services solution," B. Courtois, CMP, France
• "Microsystems: Research task, education task, application fields, examples," H. Detter, Technical University of Vienna, Austria
• "Silicon carbide parameters for process and device CAD tools," S. Dimitrijev, Griffith University, Australia
• "Challenges facing power BiCMOS integration," T. Efland, Texas Instruments, USA
• "Future microelectronics beyond roadmaps," S. Hillenius, Lucent Technologies Inc., USA
• "Quantum well intermixing for optoelectronic device integration," C. Jagadish, Australian National University, Australia
• "Diamond technology for MEMS and electronics: Review of status and perspectives," E. Kohn, University of Ulm, Germany
• "Semiconductor device for fiber optical communication systems," L. Lunardi, JDS Uniphase Corp., USA
• "Advances in silicon carbide power MOS technology," P. Mawby, University of Wales, U.K.
• "Smart sensor interface electronics," G. Meijer, Delft University of Technology, The Netherlands
• "Circuit design in multi-GHz environment," V. Oklobdzija, University of California, USA
• "SiC device technology for high voltage and RF power applications," M. Ostling, Royal Institute of Technology, Sweden
• "Integrated hall magnetic sensors," R. Popovic, EPFL, Switzerland
• "Benefits of process and device calibration at early stages of CMOS development," H. Puchner, LSI Logic Corp., USA
• "Trends in power ICs," C.A.T. Salama, University of Toronto, Canada
• "Is innovation and competition crucial in the power semiconductor industry? A market perspective," E. M. Shankar, De Montfort University Leicester, U.K.
• "Semiconductor technologies for powering microchips in the information age: From source to load," K. Shenai, University of Illinois at Chicago, USA
• "Technology options for developing manufacturable nanoelectronics," R. Singh, Clemson University, USA
• "MOCVD and PVD diffusion barriers for copper interconnect," S. C. Sun, Taiwan Semiconductor Mfg. Co., Taiwan
• "Progress in intelligent power semiconductor devices," Y. Uchida, Fuji Electric Co., Japan
• "Biologically inspired optical vision sensors," J. Van der Spiegel, University of Pennsylvania, USA
• "Reliability of microsystems from the materials point of view," J. Villain, University of Applied Sciences, Augsburg, Germany
• "Recent developments in silicon optoelectronic devices," H. Wong, City University of Hong Kong
• "Silicon technology: Nanoscale CMOS and the road beyond," P. Wong, IBM, USA

MIEL 2002 will be organized by the ED/SSC Yugoslavia Chapter, in cooperation with the Faculty of Electronic Engineering, University of Nis, and Ei-Holding Co.-Nis; under the cosponsorship of the IEEE EDS, with the cooperation of the IEEE SSCS; and under the auspices of Serbian Ministry of Science, Technology, and Development, Yugoslav Secretariat of Development and Science, Yugoslav Academy of Engineering, and City Assembly of Nis.

Prof. Dr. Ninoslav Stojadinovic
MIEL 2002 Conference Chairman
nino@unitop.elfak.ni.ac.yu

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