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| CICC Celebrates 25 Years of Innovation,
Education, and Communication The Custom Integrated Circuits Conference (CICC), a premier conference for information on leading-edge analog and digital circuits, celebrates its 25th year, 21-24 September in San Jose, California. CICC is dedicated to IC development, showcasing original first-published technical work and innovative circuit techniques tackling practical problems. CICC has evolved with the industry to cover a broad spectrum of technical topics and offers attendees a total educational experience including paper presentations, exhibits, panels, tutorials, and interesting networking events. This year the program consists of in-depth educational sessions, advanced technical sessions (including new sessions on emerging technology), panel discussions, technical/commercial exhibits, exhibitor preview sessions, and networking opportunities. Bob Lucky Leads Off the Technical Program CICC is very proud to announce the keynote speaker for 2003, Dr. Robert W. Lucky, author of the bimonthly "Reflections" column in IEEE Spectrum magazine. Dr. Lucky, an IEEE Fellow, is well known for his groundbreaking work in adaptive equalization at AT&T Bell Labs. He has served as the Executive Director of the Communication Sciences Research Division at Bell Labs and as Chair of the Scientific Advisory Board for the United States Air Force. Dr. Lucky also has received numerous honorary doctorates and industry awards, including the Marconi Award for his contribution to data communications. Dr. Lucky's discussion of technology in the midst of telecom turmoil will provide a lively opening to the CICC technical program, Monday, 22 September. Lunch Talk on Robots During lunch on Tuesday, 23 September, Dr. Tsugio Makimoto of Sony Corporation will present a historical review of robots, highlighting the critical role played by chip technology. Dr. Makimoto also will share the story of Sony's entertainment robots, including a dog-like robot, AIBO, and a biped humanoid robot. This promises to be a fascinating and educational experience. Panel Discussions Three spirited panel discussions on Tuesday, 23 September, will feature experts sure to offer strong opinions on the following topics: Outsourcing! From Fabrication to Packaging, and Now Design-Will the U.S. Semiconductor Industry Survive Overseas Outsourcing? The semiconductor industry witnessed a dramatic rise in the number of fabless companies in the 1990s. Company business models were based on access to IC manufacturing processes at foundries such as TSMC and Chartered Semiconductor, and on access to assembly plants in South-East Asia. As the cost of building fabs became an ever-increasing percentage of corporate revenues, even traditional IC companies started to outsource part of their manufacturing and assembly to the same foundries. This trend shows no sign of slowing down as both assembly and even design are being outsourced to overseas companies. Panelists will discuss these trends and the serious consequences for the future of the IC industry in the U.S. Panelists: Ed Ross, President, TSMC, USA Jim Clifford, Senior Vice President, Qualcomm Representative from WiPro Brian Fitzgerald, CEO, ChipWrights AnnLee Saxenian, U.C. Berkeley Representative from Motorola Are Analog Device Models Really That Bad or Are They Just a Convenient Excuse? The poor accuracy of transistor models is a constant complaint of circuit designers. Why has research to improve transistor model equations done little to alleviate these complaints? Is the pace of technology change too fast for stable models to emerge? Is it the nature of our industry to constantly push past the limit so that this problem will never go away? Or, are the models just an easy excuse for missed deadlines and product specs? Panelists: Pieter Vorenkamp, Broadcomm Yannis Tsividis, Columbia University Dan Foty, Gilgamesh Associates Colin McAndrew, Motorola Ali Niknejad, Co-director BSIM Project, U.C. Berkeley Yu-Tai Chia, Department Manager of Spice Modeling, TSCM Weidong Liu, Senior Manager for Mixed-Signal Simulation and TCAD, Synopsys Technology: Falling Short of Product Developer Needs? The introduction of 130-nm technology was anything but "seamless." Furthermore, the technology delivers less performance than expected and the future doesn't look promising. For example, performance benefits of the next process generation are questionable. Leakage power, ignored by designers for so long, will limit future designs. Adding to the pain are exploding mask costs. What can product developers expect from technology suppliers in the future to satisfy consumers' needs? Panelists: Dan Lenoski, Vice President Engineering, Cisco Systems Erich Goetting, Vice President, Advanced Product Group, Xilinx, Inc. Jack Sun, Senior Director, Logic Technology R&D, TSMC Simon Yang, Vice President, Logic Technology Development and Manufacturing, SMIC Scott Crowder, Foundry Technology Development, IBM Microelectronics Exhibits Monday afternoon the exhibitor preview sessions kick off the opening of the Exhibits Hall. Here many of our exhibitors will present overviews of new products and services. As always, our exhibits will include displays and demonstrations by semiconductor manufacturers, software tool suppliers, design service houses, and leading electronics industry publications providing the latest technical information on new integrated-circuit design products. The Exhibit Hall also will be the site for Monday's Exhibitors' Reception and Tuesday evening's Happy Hour, opportunities for attendees to network with their colleagues and the exhibitors. Additional Information The conference will take place at the Double Tree Hotel in San Jose, California. The complete advance program and registration form can be downloaded from the CICC Web site at www.ieee-cicc.org. For additional information and general inquiries about the CICC, please contact the Conference Manager, Melissa Widerkehr, CICC, 16220 South Frederick Avenue, Suite 312, Gaithersburg, MD 20877; Tel: (301) 527-0900/101; or email: cicc@his.com.
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