Topic Committee:
INTERNATIONAL ADVISORY COMMITTEE
Roel G. Baets, INTEC Department of Information Technology, Belgium
Philippe M. Fauchet, University of Rochester, Rochester, USA
Siegfried Janz, NRC-IMS Institute for Microstructural Sciences, Canada
Lionel C. Kimerling, MIT, Cambridge, USA
Thomas L. Koch, Lehigh University, USA
Mario Paniccia, Intel Corporation, USA
Douglas J. Paul, University of Cambridge Cavendish Laboratory, UK
Lorenzo Pavesi, University of Trento, Italy
Albert Polman, FOM Center for Nanophotonics, the Netherlands
Gernot S. Pomrenke, AFOSR Office of Scientific Research, USA
Francesco Priolo, University of Catania, Italy
Jagdeep Shah, DARPA/MTO Microsystems Technology Office, USA
Jung Hoon Shin, KAIST, Korea
Richard Soref, AFRL/SNHX Electromagnetics Technology Division, Hanscom AFB, MA, USA
Kazumi Wada, University of Tokyo, Japan
Kang L. Wang, University of California - Los Angeles, USA
Koji Yamada, NTT Microsystem Integration Laboratories, Japan
JinZhong Yu, Chinese Academy of Sciences Beijing Institute of Semiconductors, China
PROGRAM COMMITTEE
Lorenzo Pavesi, Co-Chair, University of Trento, Italy
Francesco Priolo, Co-Chair, University of Catania, Italy
Eric Cassan, CNRS-IEF, Orsay, France
Salvo Coffa, ST Microelectronics, Italy
Nico F. de Rooij, UniNe-IMT Institute of Microtechnology, Switzerland
Jean-Marc Fedeli, CEA-LETI Lab d'Electronique, de Technologie et d'Instrument, France
Martin A. Green, University of New South Wales, Australia
Detlev Gruetzmacher, Research Center Jülich, Germany
Erich Kasper, University of Stuttgart, Germany
Andrew P. Knights, McMaster University, Canada
Thomas L. Koch, Lehigh University, USA
Javier Marti, UPV-NTC Nanophotonics Technology Center, Spain
Gianlorenzo Masini, Luxtera, Inc., USA
Mario Paniccia, Intel Corporation, USA
Andrew W. Poon, Hong Kong University of Science and Technology, Hong Kong
Graham T. Reed, University of Surrey, UK
Marco Romagnoli, Pirelli Labs - Optical Innocation, Italy
Jung Hoon Shin, KAIST, Korea
Kazumi Wada, University of Tokyo, Japan
Dan-Xia Xu, NRC-IMS Institute for Microstructural Sciences, Canada
Koji Yamada, NTT Microsystem Integration Laboratories, Japan
