Topic Areas


Optical Interconnects & Processing Systems

The Optical Interconnects and Processing Systems subcommittee solicits papers on advanced optical interconnection system architectures; enabling technologies, and signal processing and coding for optical interconnects in computer, memories, neural and sensor network systems. Technologies for board scale and chip scale optical interconnects include chip to network integration; CMOS compatible photonic material and devices; silicon photonics, plasmonics and PLC for system integration; light generation in silicon; arrays of integrated optoelectronic devices.


Committee Members:

Chair:Yeshaiahu Fainman
University of California - San Diego, USA
Alyssa Apsel
Cornell University, USA
Ravindra Athale
MITRE Corp., USA
Michael Haney
University of Delaware, USA
H. Scott Hinton
Utah State University, USA
Jeffrey Kash
IBM Research TJ Watson Research Center, USA
Ashok Krishnamoorthy
Sun Microsystems, USA
El-Hang Lee
Inha University, Korea
Brian Lemoff
"Institute for Scientific Research, Inc. ", USA
Frederick McCormick
Sandia National Laboratories, USA
David Miller
Stanford University, USA
David Plant
McGill University, Canada
Demetri Psaltis
California Institute of Technology, USA
Elias Towe
Carnegie Mellon University, USA
Nikolay Zheludev
University of Southampton, UK


Invited Speakers:

A 4 Channel WDM Silicon Photonics Transceiver Integrated with Electronics in a Volume CMOS Process
Cary Gunn, Luxtera, Inc., USA
Slowing Light and Changing Its Color on a Silicon Chip
Michael Lipson, Cornell University, USA
The Convergence of Informatics and Lightwave Communications
George C. Papen, University of California - San Diego, USA
All-Optical and Optoelectronic Serial-to-Parallel Conversion of High-Speed, Asynchronous Optical Packets
Ryohei Urata, NTT Corporation, Japan
Advances in Photonic Integrated Circuits (PIC) and the Associated Impact on Fiber Optic Transmission Systems
David F. Welch, Infinera, USA


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