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Topic Areas
Optoelectronic Packaging Manufacturing & Reliability
The subcommittee on Optoelectronic Packaging, Manufacturing and Reliability solicits papers on advances in the design, development techniques, materials, manufacturing, and underlying technology of optoelectronic packaging. This includes issues associated with optical components and optical coupling within the package, package reliability, and all aspects of manufacturing including materials handling, design, assembly processes and the assessment and improvement of optoelectronic device reliability. In particular, papers are solicited in the following areas: passive optical alignment techniques, highspeed parallel optical links, WDM component integration, VCSEL packaging, non-hemetic packaging, mulifiber connectors, plastic OE packaging, packaging modeling, high speed packaging and substrate design, optoelectronic MEMS packaging, novel bonding and assembly techniques, and high-power laser packaging.
Committee Members:
| Chair: | Karen Matthews
Corning Inc., USA |
| Terry Alford
Arizona State University, USA |
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Muhannad Bakir
Georgia Institute of Technology, USA |
| Nagesh Basavanhally
Lucent Technologies, USA |
| Mark Beranek
Naval Air Systems Command, USA |
| Aaron Bond
Apogee Photonics, Inc., USA |
| Ray Chen
University of Texas at Austin, USA |
| Mario Dagenais
University of Maryland, USA |
| Badri Gomatam
Vitesse Semiconductor, USA |
| Hongtao Han
Digital Optics Corporation, USA |
| Paul Haugsjaa
Polycision, Inc., USA |
| Masataka Ito
Ibiden USA R&D Inc., USA |
| Yung-Sheng Liu
Industrial Technology Research Institute, Taiwan, R.O.C. |
| Matt Pearson
Enablence Inc., Canada |
| Volker Plickert
opTricon, Germany |
| Min-Yi Shih
OptiComp Corporation, USA |
| Kimio Tatsuno
Hitachi, Ltd. Central Research Laboratory, Japan |
| Robert Thornton
R. L. Thornton & Associates, USA |
Invited Speakers:
Contract Manufacturing Trends for Advanced Optical Transceivers
Teera Achariyapaopan, Fabrinet Co., Ltd., Thailand |
3D Routing in Optical Boards
Alexei Glebov, Fujitsu Laboratories of America, USA |
Athermal AWG Devices for WDM-PON Architectures
Jan Ingenhoff, Ignis Photonyx Inc., Canada
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Silicon Micro Machined Hermetic Packaging Technology for Optical Subassemblies
Arnd Kilian, Hymite GmbH, Germany
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Wafer Scale Assembly and Test for the Production of Opto-Electronic Components
Joerg R. Kropp, Ezconn Europe GmbH, Germany
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Passive Alignmnet Techniques as a Route to Low-Cost Hybrid Photonic Integrated Circuits
Graeme Maxwell, Centre for Integrated Photonics, UK
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For more information:
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Christine Bluhm
Conference Administrator
Phone + 1 732-562-3896
Fax + 1 732-562-8434
c.bluhm@ieee.org
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