Advanced Program:
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Conference Information:
The subcommittee on Optoelectronic Packaging, Manufacturing and Reliability solicits papers on advances in the design, development techniques, materials, manufacturing, and underlying technology of optoelectronic packaging.
This includes issues associated with optical components and optical coupling within the package, package reliability, and all aspects of manufacturing including materials handling, design, assembly processes and the assessment and improvement of optoelectronic device reliability. In particular, papers are solicited in the following areas: passive optical alignment techniques, highspeed parallel optical links, WDM component integration, VCSEL packaging, non-hemetic packaging, mulifiber connectors, plastic OE packaging, packaging modeling, high speed packaging and substrate design, optoelectronic MEMS packaging, novel bonding and assembly techniques, and high-power laser packaging.
