Optoelectronic Packaging, Manufacturing and Reliability

The subcommittee on Optoelectronic Packaging, Manufacturing and Reliability solicits papers on advances in the design, development techniques, materials, manufacturing, and underlying technology of optoelectronic packaging.  This includes issues associated with optoelectronic components and optical coupling within the package, package reliability, and all aspects of manufacturing including materials handling, design, assembly processes and the assessment and improvement of optoelectronic device reliability.  In particular, papers are solicited in the following areas: passive optical alignment techniques, high-speed parallel optical links and connectors, high-speed packaging and substrate design WDM component integration, VCSEL packaging, hermetic and non-hermetic packaging, organic OE packaging, packaging modeling, , optoelectronic MEMS packaging, novel bonding and assembly techniques, novel packaging materials (nanotechnology), high-power laser packaging, photovoltaic modules, and solar panels.