Optoelectronic Packaging, Manufacturing and Reliability
Topic Committee:
Chair:
Min-Yi Shih, Physical Optics Corporation, USACommittee Members:
Muhannad Bakir, Georgia Institute of Technology, USANagesh Basavanhally, Alcatel-Lucent, USA
Mark Beranek, US Naval Air Systems Command, USA
Ray Chen, University of Texas at Austin, USA
Julian Cheng, University of Texas at Austin, USA
Badri Gomatam, Vitesse Semiconductor Corporation, USA
Masataka Ito, IBIDEN, USA
Karen Matthews, Corning, Inc., USA
Rick Stevens, Lockheed Martin, USA
Kevin Thorson, Lockheed Martin, USA
Todd Tolliver, General Electric Company, USA
Announcements:
Paper Submission Deadline:
9 July 2008
Conference Forms:
Short Courses
Registration Form

