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Optoelectronic Packaging, Manufacturing and Reliability

Topic Committee:

Chair:

Min-Yi Shih, Physical Optics Corporation, USA

Committee Members:

Muhannad Bakir, Georgia Institute of Technology, USA
Nagesh Basavanhally, Alcatel-Lucent, USA
Mark Beranek, US Naval Air Systems Command, USA
Ray Chen, University of Texas at Austin, USA
Julian Cheng, University of Texas at Austin, USA
Badri Gomatam, Vitesse Semiconductor Corporation, USA
Masataka Ito, IBIDEN, USA
Karen Matthews, Corning, Inc., USA
Rick Stevens, Lockheed Martin, USA
Kevin Thorson, Lockheed Martin, USA
Todd Tolliver, General Electric Company, USA

Announcements:

Paper Submission Deadline:
9 July 2008

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Mary S. Hendrickx
Phone +1 732 562 3897
Fax +1 732 562 8434
m.hendrickx@ieee.org
 

 

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