Optoelectronic Packaging, Manufacturing and Reliability

Invited Speakers:

Review of Polymer Optical Waveguide Technologies
Bruce L. Booth, Optical Interlinks, USA

Grand Challenges and Solutions for High-Speed Electrical Interconnects and Opportunities for Disruptive Interconnect Technologies
John Eble, Rambus Inc., USA

Polymer Microring Resonator for Sensitive and Broadband Ultrasound Detection
Jay L. Guo, University of Michigan, USA

Terabus: Chip-to-Chip Board-Level Optical Data Buses
Jeffrey A. Kash, IBM Research Center, USA

A Review of Optical Interconnect (on board or others) Development in Japan
Kazuhiko Kurata, NEC Corporation, Japan

Wide Temperature Tunable Laser Packaging for Avionics WDM LAN Applications
Jing Ma, OptoNet, Inc., USA

Challenges to Ultra-Efficient Solid-State Lighting
Jeff Y. Tsao, Sandia National Laboratories, USA

Optical Bus for Intra- and Inter-Chip Optical Interconnects
Alan X. Wang, Omega Optics Inc., USA