Advance Program:
Conference Information:
Fabrication technologies which have emerged in the last few years aim
to reduce the manufacturing costs of photonic integrated
circuits, among them are imprinting technologies. These technologies
not only have the ability to lower the cost (e.g. hot embossing, UV
embossing), but are also used to greatly reduce the feature size (e.g.
Nanoimprinting) and realize novel waveguide based components.
Imprinting
is not only useful for telecommunication devices, but
enables also the combination of Photonics with Fluidics
and Biology to fabricate all kinds of devices for application in the
Life Sciences.
The goal of this topical meeting is to bring together
leading experts in science and industry to present and
discuss the current state of the art in this emerging
field, covering all aspects from design to fabrication
of devices.
Key topics to be covered in this symposium include:
- Nanoimprinting of PICs
- Hot embossing of PICs
- UV Embossing of PICs
- Soft lithography of PICs
- Template/Stamp fabrication (e.g. electroplating,
dry etching, etc.)
- Devices – PICs and Cross Discipline Applications
