Michel Bruel created and patented the Smart Cut process, a method of producing high volumes of semiconductors in ultra-thin, Silicon on Insulator (SOI) wafers. Smart Cut technology makes it possible to cut a very thin layer of single crystal semiconductor from a bulk semiconductor wafer, and transfer it to any kind of other substrate. This thinner and smaller chip fabrication, increased the speed of the processor and lowered the power consumption, thereby making SOIs attractive to a wider variety of applications, including portable electronics, laptop computers, smart power devices and navigational aids. Early in his career, Dr. Bruel headed the Ion Implantation group at Commissariat a l'Energie Atomique - Laboratoire d'Electronique et de Traitement de I'lnformation (LETI) in Grenoble, France, and is currently LETI Scientific Advisor
