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What's New @ IEEE in Circuits

VOLUME 6              NUMBER 2              FEBRUARY 2005

CONTENTS:
1. High-Speed ICs Enable Record-Breaking Data Transmission Speeds
2. Microwave Week Returns to Long Beach, California in 2005
3. Molecular "Transistor" Prototype to Sustain Moore's Law
4. Sony Unveils "Supercomputer-on-a-Chip" at IEEE ISSCC
5. New Proceedings Track Advances in Electronic Components
6. IEEE Study Group Crafts Quality Standard for Carbon Nanotubes
7. Atomic Nanobridges Spark Interest in Memory and Logic Chips
8. Chip Making's Singular Future: IEEE Spectrum Reports
9. Backscatter: All in A Day's Work
10. New Job Postings on IEEE Job Site More Than Double in 2004
11. IEEE Membership Grows in 2004
12. New Book Details Delta-Sigma Converters for First-Time Users
13. German Firm Introduces Plastic RFID Tag


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1. HIGH-SPEED ICS ENABLE RECORD-BREAKING DATA TRANSMISSION SPEEDS
Error-free performance at record-breaking data transmission speeds of 25 Gbit/s -- more than double speeds available over today's existing architectures -- were recorded by researchers at Bell Labs and FCI, Inc. The breakthrough is based on a cutting-edge connector with carefully controlled impedance characteristics created by FCI and the duo-binary signaling technique developed at Bell Labs. Researchers say that they are working with the technology to achieve processing speeds of 100 Gbit/s. Learn more: www.commsdesign.com/showArticle.jhtml?articleID=59300103

Researchers at Bell Labs unveiled the theory behind duo-binary signaling at the IEEE Microwave Symposium in June 2004. Access the proceedings for a first-hand look at the technology behind this breakthrough: ieeexplore.ieee.org/xpl/RecentCon.jsp?puNumber=9277

2. MICROWAVE WEEK RETURNS TO LONG BEACH, CALIFORNIA IN 2005
For the first time since 1989, the IEEE Microwave Symposium returns this year to the California city of Long Beach. Dubbed "Microwave Week," the conference features workshops, tutorials, special sessions and an exhibition featuring cutting-edge innovations in the fast-moving technological arena. Microwave Week features three separate symposia: the IEEE International Microwave Symposium, the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium and the IEEE Automatic RF Techniques Group (ARFTG) Symposium. Registrants are invited to all three. Microwave Week begins on 12 June. For additional information, or to register, visit: www.ims2005.org/

Don't miss the next conference you need for your career. IEEE sponsors more than 300 technical conferences and workshops each year, highlighting the latest technological advances. Find events through the IEEE ConferenceSearch Web site at: www.ieee.org/conferencesearch/

3. MOLECULAR "TRANSISTOR" PROTOTYPE TO SUSTAIN MOORE'S LAW
Unveiled earlier this month, the HP Quantum Research Group has developed a transistor alternative -- the "crossbar latch" -- which consists of a wire crossed by two other wires. The junctions where the wires meet serve as switches that transform electrical pulses into binary zeros and ones to perform logic operations. The researchers believe that the "crossbar latch" sustain Moore's Law in the coming years and plan to create a 32-nanometer prototype within the next eight years. Learn more: www.technewsworld.com/story/HP-Design-Could-Aid-Ultra-Small-Electronics-40239.html

4. SONY UNVEILS "SUPERCOMPUTER-ON-A-CHIP" AT IEEE ISSCC
Hailed as a "supercomputer on a chip," a new microprocessor called the "Cell" debuted earlier this month at the IEEE International Solid-States Circuits Conference (ISSCC). According to researchers at Sony, the microprocessor is made up of a grid of cells that perform individual tasks, and enhances network capabilities so that one computer may store data in the memory of another. Sony plans to implant the chip into the 2006 Sony Playstation. For more information, visit: www.elitestv.com/pub/2005/Feb/EEN420790bdd27ad.html

5. NEW PROCEEDINGS TRACK ADVANCES IN ELECTRONIC COMPONENTS
The latest advances in polymers for electronic packaging and component finishes for lead-free electronics, as well as feature papers on MEMs and nanotechnology, are now available through the proceedings of the 54th IEEE Electronic Components and Technology Conference (ECTC 2004). The proceedings reflect the convergence of state-of-the-art technologies through the collaboration of educators, scientists, and industry professionals. Topics covered include thermal management materials, nanoscale packaging, integrated passive technology, lead-free solders and much more. For additional information, or to purchase the proceedings, visit ShopIEEE: shop.ieee.org/store/product.asp?prodno=CH37546 
***IEEE members save up to 60% off the list price for conference proceedings titles***

6. ATOMIC NANOBRIDGES SPARK INTEREST IN MEMORY AND LOGIC CHIPS
A prototype of a nanoscale electrical switch reaches processing speeds of 1 gigahertz with a millivolt of energy, according to researchers at the Japanese National Institute for Materials Science. The device, named the quantized conductance atomic switch, has no moveable parts and applies properties of quantum physics that allow electrical conductance to fluctuate by discrete amounts. Researchers say that the technology could transform the future of memory and logic chips. Learn more at: www.trnmag.com/Stories/2005/012605/Nano_bridge_builds_logic_012605.html

7. IEEE STUDY GROUP CRAFTS QUALITY STANDARD FOR CARBON NANOTUBES
The rapid growth of carbon nanotubes as performance additives and their emerging use in electronics and other fields have created a call to assure nanotube consistency and reliability. Since a widely accepted quality standard for these materials does not exist, the IEEE has formed the IEEE Carbon Nanotube Quality Testing Study Group to begin to define uniform protocols for nanotube characterization. The group intends to have an initial nanotube quality standard in place within one year. For further details and contact information, visit: standards.ieee.org/announcements/pr_icnqtsg.html

8. CHIP MAKING'S SINGULAR FUTURE: IEEE SPECTRUM REPORTS
The transition from batch processing to single wafer manufacturing marks the latest cost-cutting trend in the semiconductor industry, reports IEEE Spectrum. With an up-side including the ability to build chips on demand and create of more reliable ICs, single-wafer manufacturing provides a higher quality ICs through a more-affordable cost structure. Other benefits include decreased inventory levels, faster time-to-market, and lower rent. Learn more: www.spectrum.ieee.org/WEBONLY/publicfeature/feb05/0205chip.html

9. BACKSCATTER: ALL IN A DAY'S WORK
An engineering career can provide excitement and even drama, but how can we convince young people who might be considering studying engineering in college that the profession is every bit as interesting and exciting as we believe it to be? Don Christiansen thinks Tracy Kidder's "The Soul of a New Machine" might be a good place to start. In the latest edition of IEEE-USA Today's Engineer: www.todaysengineer.org/2005/Feb/backscatter.asp

10. NEW JOB POSTINGS ON IEEE JOB SITE MORE THAN DOUBLE IN 2004
Job listings available to IEEE members through the IEEE Job Site more than doubled in 2004, jumping to more than 5,000 jobs compared to 2,346 in 2003.  The site also put programs in place to expand job listings around the world. For more information on the IEEE Job Site, or to sign up, visit: www.ieee.org/jobs

11. IEEE MEMBERSHIP GROWS IN 2004
IEEE membership rose in 2004, totaling 365,483 members worldwide, a 1.2% increase over year-end 2003. Student membership rose 7% and now exceeds 68,000 students in more than 1,300 IEEE Student Branches. IEEE membership also experienced growth in Asia/Pacific, Europe and Canada. As the largest technical professional society in the world, the IEEE provides its members with broad variety of information services and other benefits. For information on joining IEEE, visit: www.ieee.org/join

To renew your IEEE membership for 2005, visit: www.ieee.org/renewal

12. NEW BOOK DETAILS DELTA-SIGMA CONVERTERS FOR FIRST-TIME USERS
A new book from Wiley-IEEE Press, "Understanding Delta-Sigma Data Converters," details real-world operations of Delta-Sigma converters to generate insight into industry applications. Authors Richard Schreier, winner of the Outstanding Paper Award at the 2002 IEEE International Solid-State Circuits Conference, and Gabor C. Temes, recipient of the 1998 IEEE Graduate Teaching Award, contextualize the uses of first-, second- and higher-order delta-sigma modulation using the Delta-Sigma Toolbox, a design-oriented software. Learn more about this title at: www.wiley.com/WileyCDA/WileyTitle/productCd-0471465852,miniSiteCd-IEEE.html
***IEEE members: Receive a 15% discount on any Wiley-IEEE Press titles. Use code 18493 at checkout***

13. GERMAN FIRM INTRODUCES PLASTIC RFID TAG
PolyIC of Erlangen, Germany, is launching the first RFID tags printed using conducting and semiconducting polymer inks on a polyester substrate. Up until now, etched microchips have been the medium of choice for such tags. The new tags store just four bits compared to the 128 bits as on the tags used by large chain stores. This puts PolyIC's tags out of the running for some uses -- for now. However, by 2008, PolyIC plans to develop the technology and encoding so that their versions will store as much as the microchip version at a fraction of the cost. Initially, PolyIC plans to market its version for use to combat drug counterfeiting. For more information: www.newscientist.com/article.ns?id=mg18524846.400


WHAT'S NEW @ IEEE IN CIRCUITS is a monthly, opt-in email update designed to provide you with the latest news regarding IEEE activities, industry trends, career development tips, and new IEEE product releases. We welcome your feedback on this service.

Managing Editor: John Platt j.platt@ieee.org
Editor: Bhavika Desai
Contributing Editor: Peg Gallos

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