What's New @ IEEE in Circuits

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VOLUME 4 NUMBER 7 JULY 2003

CONTENTS:
1. CICC Celebrates 25 Years of Innovation, Education, Communication
2. IBM to Put Supercomputers Out On Loan
3. New Book Looks at Emerging Nanotechnology
4. IEEE Standards Board Approves Speedier IEEE 802.11 WLAN
5. IEEE Board Announces New Journals for 2004
6. Ultratech Premiers New Laser Thermal Processing Capability
7. United Microelectronics Releases Details of Strained Silicon Process
8. They Know Where You Are: IEEE Spectrum Reports
9. New and Next Wave Circuits and Systems Investigated in Proceedings
10. Backscatter: Who's in Charge Here?
11. SIA Forecasts Chip Industry Growth Through 2006
12. Free Abstracts Now Available in IEEE Xplore
13. The Global Engineer: Succeeding Without Boundaries

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1. CICC CELEBRATES 25 YEARS OF INNOVATION, EDUCATION, COMMUNICATION
In honor of its silver anniversary, the 25th IEEE Custom Integrated Circuits Conference (CICC) will feature four education sessions, a technical program kickoff by Bob Lucky and Tuesday lunch talk on robots featuring Sony's chip technology that powers Sony's entertainment robot, AIBO. CICC is scheduled for 21 to 24 September in San Jose California, USA. Find out more about the program and how to register at: www.ieee-cicc.org/

Don't miss the next conference you need for your career. IEEE sponsors more than 300 technical conferences and workshops each year, highlighting the latest technological advances. Find events through the IEEE ConferenceSearch Web site at: www.ieee.org/conferencesearch/

2. IBM TO PUT SUPERCOMPUTERS OUT ON LOAN
Citing the prohibitive cost of owning and operating supercomputers -- vastly powerful computing machines made up of thousands of CPUs -- IBM Corp. has built a facility designed to offer its supercomputing power to customers over the Internet for a fee, the company said. IBM is banking on the idea that prospective customers will use their funding to rent this capability rather than invest that money on their own presumably smaller and inferior systems. Read more at: www.einsite.net/electronicnews/index.asp?layout=articlePrint
&articleID=CA306938

3. EMERGING NANOTECHNOLOGY FOCUS OF NEW IEEE PRESS BOOK
Nanotechnology is the focus of "Future Trends in Microelectronics: The Nano Millennium," a new book on microelectronics edited by Serge Luryi, Jimmy Xu and Alex Zaslavsky. The book from Wiley-IEEE Press makes the case that the evolution of this technology, acknowledged by the U.S. government as one of the top areas of emerging technology, presents an unprecedented opportunity to impact the future of the world. This volume offers a collection of articles based on ideas raised during the summer of 2001 at the third meeting in the Future Trends in Microelectronics (FTM) workshop series. Find out more about this new book at: www.wiley.com/WileyCDA/WileyTitle/productCd-0471212474.html
***IEEE members: Receive a 15% discount on any Wiley-IEEE Press titles. Use code 18493 at checkout***

4. IEEE STANDARDS BOARD APPROVES SPEEDIER IEEE 802.11 WLAN
Speed is the goal of IEEE 802.11g™. The latest iteration of the most widely used wireless local area network (WLAN) standard was recently ratified by the IEEE Standards Board. The new amendment to the IEEE 802.11™ standard increases the data rate to 54 Mbps (megabits per second) from the previous IEEE 802.11b™ network rate of 11 Mbps. This change allows the networks to handle up to five times more users than the prior version and opens up the possibility of using IEEE 802.11 networks for wireless multimedia video and broadcast technology. The new standard also allows for both IEEE 802.11g and IEEE 802.11b devices to work on the same network. Read more at: standards.ieee.org/announcements/80211gfinal.html

Pre-order the IEEE 802.11g standard in the IEEE Online Catalog & Store: Print - shop.ieee.org/store/product.asp?prodno=SH95134
PDF - shop.ieee.org/store/product.asp?prodno=SS95134

5. IEEE BOARD ANNOUNCES NEW JOURNALS FOR 2004
The IEEE Board of Directors has approved five new technical periodicals for publication in 2004. Included are: IEEE/ACM Transactions on Computational Biology and Bioinformatics; IEEE Distributed Systems Online; IEEE Geoscience and Remote Sensing Letters; IEEE Transactions on Automation Science and Engineering; and IEEE Transactions on Dependable and Secure Computing. All will be available through IEEE Xplore and various IEEE online collections. More information on these journals, including how to subscribe, will be available soon. For more information on IEEE publications, please go to: www.ieee.org/products/periodicals.html

6. ULTRATECH PREMIERS NEW LASER THERMAL PROCESSING CAPABILITY
Ultratech Inc. of San Jose, California, USA, recently started shipment on research and development tools for a new laser thermal processing (LTP) capability the company says should scale down to the 20-nanometer manufacturing process node. The LTP technology is expected to break through current limitations and become a strong factor in the nanotechnology era in the same way as its predecessor, rapid thermal processing (RTP). Read more at: www.siliconstrategies.com/story/OEG20030625S0024

7. UNITED MICROELECTRONICS RELEASES DETAILS OF STRAINED SILICON PROCESS
Strained silicon technology introduced by United Microelectronics Corporation (UMC) has shown more than a ten percent speed increase in recent tests, the company said. The technology, using AmberWave substrate wafers, showed in a recent published paper more than a 20-percent current driving capability over a 70 nm strained silicon transistor. Read more at: compoundsemiconductor.net/articles/news/7/6/19

8. THEY KNOW WHERE YOU ARE: IEEE SPECTRUM REPORTS
New technologies such as RFID, E911 and ultrawideband are capable of pinpointing users' locations at any time, promising safety and convenience but threatening privacy. In its July cover story, IEEE Spectrum magazine looks at these new location technologies, explains the way they work, and discusses their applications, both now and in the future. Read more: www.spectrum.ieee.org/WEBONLY/publicfeature/jul03/e911.html

9. NEW AND NEXT-WAVE CIRCUITS AND SYSTEMS INVESTIGATED IN PROCEEDINGS
The 2003 IEEE International Symposium on Circuits and Systems (ISCAS) took a focused look at new and next-wave technologies including short-distance communications, mixed-signal systems-on-a chip and sensor interfaces and biosystems. The newly-released proceedings of this symposium cover topics from analog circuits and signal processing to communications, multimedia systems and computer aided network design. Now available in the IEEE Online Catalog & Store: shop.ieee.org/store/product.asp?prodno=CH37430
***What's New Special - Use Code WNI for 15% Off - order instructions below***

10. BACKSCATTER: WHO'S IN CHARGE HERE?
Since the beginnings of the profession, engineers have tried to ensure that the technologies they develop are implemented effectively and responsibly for the common good. Over the years, however, engineers have seen the amount of control they retain over their innovations diminish, yielding some of the responsibility to a host of competing interests. Engineers have learned to accept their role as partners in a larger bureaucracy, but still the underlying question remains: who's in charge? Donald Christiansen explores the dynamic in the latest edition of IEEE-USA Today's Engineer: www.todaysengineer.org/June03/backscatter.asp

11. SIA FORECASTS CHIP INDUSTRY GROWTH THROUGH 2006
In its 2003-2006 midyear forecast, the Semiconductor Industry Association (SIA) predicted a 16.8 percent industry growth for 2004 and a compound annual growth rate of 9.8 percent through 2006 worldwide. SIA officials point to significant increases in memory, DRAM and Flash and significant growth in the computer, consumer and communications sectors as key indicators for the positive outlook. Read more at: www.semichips.org/pre_release.cfm?ID=273

12. FREE ABSTRACTS NOW AVAILABLE IN IEEE XPLORE
Guest users of the IEEE Xplore® online delivery platform can now access free abstracts to all online articles, and current subscribers can utilize new linking features to make research faster and more efficient than ever before. Version 1.5 of IEEE Xplore, which powers the IEEE Member Digital Library as well as IEEE online collections for institutions, was released this month with the following enhancements:

Free abstract records now available for guests
Google™ to index IEEE Xplore
Consolidated title history links for IEEE journals and magazines
Reference links to the ASK*IEEE document delivery service to purchase papers not found in IEEE Xplore
IEEE magazines display in browse list now organized by first keyword

For more information on this release, visit: ieeexplore.ieee.org/xpl/ReleaseNotes.jsp

To start using these new features, visit IEEE Xplore: ieeexplore.ieee.org/

13. THE GLOBAL ENGINEER: SUCCEEDING WITHOUT BOUNDARIES
Globalization is rapidly changing the way business is conducted around the world. Boundaries are vanishing, and even unlikely countries are emerging as major players in the new economy. For those who are up to the challenge, a career as a global engineer can be an exciting and rewarding journey. IEEE-USA Today's Engineer international correspondent Terry Malkinson offers a few tips and resources for developing the skills to successfully navigate cultural differences: www.todaysengineer.org/June03/global.asp

***WHAT'S NEW @ IEEE SPECIAL - 15% OFF SELECT IEEE PRODUCTS LISTED IN THIS ISSUE!***
As a thank you to WHAT'S NEW @ IEEE subscribers, our readers receive a 15-percent discount on the purchase of any of the specially noted books and conference proceedings listed in this newsletter. When ordering from the IEEE Online Catalog & Store, located at shop.ieee.org, include the code WNI in the special instructions field at "final checkout." If ordering by phone, provide the code WNI to your customer service representative. Offer expires on 31 Dec. 2003.

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WHAT'S NEW @ IEEE IN CIRCUITS is a monthly, opt-in email update designed to provide you with the latest news regarding IEEE activities, industry trends, career development tips, and new IEEE product releases. We welcome your feedback on this service.

Managing Editor: John Platt j.platt@ieee.org
Editor: Lyle Smith l.smith@ieee.org

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