What's New @ IEEE in Circuits

July 2006 Volume 7, Number 7

IN THIS ISSUE:
1. Frozen Chip Shatters Semiconductor Speed Record
2. Systems-on-Chip: Focus on Design and Integration
3. IEEE Begins Work on First Circuit Probe Test Standard
4. Broadband Light Amplifier Created on A Silicon Chip
5. VLSI Technology Conference Accepting Paper Submissions
6. A Touch of Money: "IEEE Spectrum" Reports
7. IEEE Custom Integrated Circuits Conference Coming Soon
8. Future Chips in 3D
9. Standard for Low-Voltage Switching Devices Approved
10. The Indefatigable Inventor

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1. FROZEN CHIP SHATTERS SEMICONDUCTOR SPEED RECORD
A silicon-based chip that operates at speeds above 500 gigahertz -- 250 times faster than a typical cell phone chip -- has been created by freezing the circuit to minus 451 degrees Fahrenheit, according to its developers at IBM and the Georgia Institute of Technology. The chips used in the research are from a prototype fourth-generation silicon germanium (SiGe) technology on 200-millimeter wafers, which operate at approximately 350 gigahertz at room temperature, researchers say, and are part of a project to explore the ultimate speed limits of SiGe devices. Ultrahigh-frequency SiGe chips could enable new class of powerful, low-energy chips that will deliver future applications like HDTV and movie-quality video to cellphones, automobiles and other devices, according to developers. The research is reported in the July issue of "IEEE Electron Device Letters" (v. 27, no. 7). Read more: www.wirelessnetdesignline.com/showArticle.jhtml?articleID=189602411

The table of contents and abstracts for all papers in this issue of "IEEE Electron Device Letters" can be found in the IEEE Xplore digital library, where subscribers may also access the full text of the articles: ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=34473

2. SYSTEMS-ON-CHIP: FOCUS ON DESIGN AND INTEGRATION
The June 2006 special issue of "Proceedings of the IEEE" (v. 94, no. 6) takes a look at Systems-on-Chip: Design and Integration. The issue addresses a variety of topics, including design and industrial issues, processing and communication SoCs, and emerging SoCs technologies, all in the hope of illuminating the challenges which SoC engineers will face in the near future. To preview the guest editors' introduction, visit: www.ieee.org/web/publications/procieee/current.html

Subscribers may access the full text of this issue through the IEEE Xplore digital library: ieeexplore.ieee.org/xpl/tocresult.jsp?isnumber=34642

To commemorate the recent relaunch of "Proceedings of the IEEE," IEEE is giving away 1,000 copies of the June 2006 issue on Systems-on-Chip Design & Integration. Visit: www.ieee.org/web/publications/procieee/free_issue_form.html

3. IEEE BEGINS WORK ON FIRST CIRCUIT PROBE TEST STANDARD
The IEEE has begun to develop the first standard defining a uniform method for characterizing electrical circuit probe performance. IEEE P1696(TM), "Standard for Terminology and Test Methods for Circuit Probes," will address electrical circuit probes and probes systems, including waveform acquisition hardware and software and signal/waveform analysis software. This document will apply to probes having either signal and ground conductors or two-signal conductors. It will replace the proprietary methods that now exist at different vendors, so users can compare performance and understand probe circuit-loading effects. Visit: standards.ieee.org/announcements/pr_P1696std.html

4. BROADBAND LIGHT AMPLIFIER CREATED ON A SILICON CHIP
A broadband light amplifier has been built into a silicon chip according to researchers at Cornell University, who call the development a major breakthrough in creating photonic microchips. The amplifier uses four-wave mixing, in which a signal is "pumped" by another light source inside a waveguide 300 x 550 nanometers, researchers say, and the resulting confinement of the light waves allow the transfer of energy between the two beams. Researchers say that unlike previous attempts, their method works over a fairly broad range of wavelengths, and they have shrunk the four-wave mixing amplifiers from devices tens of meters long down to chip size. Photonic circuits on silicon are a breakthrough, according to researchers, because silicon devices can be manufactured cheaply, and photonics on silicon can easily be combined with electronics on the same chip. Photonic circuits could be used as repeaters and routers for fiber-optic communications, where several different wavelengths are sent over a single fiber at the same time, researchers say, and their broadband device makes it possible to amplify the multiplexed traffic all at once. Read more: www.eurekalert.org/pub_releases/2006-07/cuns-rcb070606.php

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5. VLSI TECHNOLOGY CONFERENCE ACCEPTING PAPER SUBMISSIONS
The 2007 International Symposium on VLSI Technology, Systems, and Applications (VLSI-TSA-Tech) is now seeking paper submissions covering interconnect technology, yield enhancement, nanoelectronic devices/technology, and related topics. Paper submissions are due 15 October 2006. The conference takes place from 23 to 25 April 2007 in Hsinchu, Taiwan. To submit a paper, or for more information: vlsitsa.itri.org.tw/2007/CallPaper/

6. A TOUCH OF MONEY: "IEEE SPECTRUM" REPORTS
According to the cover story of this month's issue of "IEEE Spectrum" (v. 43, no. 7) EEs world-wide are working to stop thieves who work in the multi-billion dollar industry of identity theft. Ideas include credit cards that are authenticated based the veins in a person's palms, the texture of a person's iris, or the minutiae of a person's fingerprints in order to provide an added layer of protection aside from a password that can easily be cracked by a skilled thief. To view the proposed plan, visit: www.spectrum.ieee.org/jul06/4123

7. IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE COMING SOON
The IEEE Custom Integrated Circuits Conference (CICC) will take place on 10-13 September 2006 in San Jose, California. IEEE CICC bills itself as the premier conference devoted to IC development, and the place to find out how to solve design problems and improve circuit design and design techniques. The conference includes technical session and poster session paper presentations, educational sessions, panel discussions, conference events and exhibits. The conference is sponsored by the IEEE Solid-State Circuits Society. For more information, visit: www.ieee-cicc.org/

8. FUTURE CHIPS IN 3D
Researchers at Harvard University have developed a process by which electronic components can reshape themselves into three-dimensional devices. The team tested their process by creating a flat, thin light detector that folded itself up into a pentagon. To do this, they used a pattern of copper wire attached to plastic tape. This was squeezed between two metal sheets, dotted with solder, and fixed with light sensing diodes. When placed in hot water, the solder points contracted, folding the device into the pentagon shape. The detector was then hooked up to a battery and was able to report infra red light from all five sides. Though the device was large compared to today's electrical components, the researchers say the process can be scaled down to the nano level, allowing chip makers to squeeze more processing into their future circuit boards. Read more: www.newscientisttech.com/article.ns?id=dn9475

QUOTE OF THE MONTH:
"Perfectionists are their own devils." ~ Jack Kirby

9. STANDARD FOR LOW-VOLTAGE SWITCHING DEVICES APPROVED
IEEE has approved a new standard for switching devices in low-voltage circuit breaker switchgear and it also began work to correct a standard for surge voltage protective equipment. The new standard, IEEE C37.13.1™, "Standard for Definite Purpose Switching Devices for Use in Metal-Enclosed Low-Voltage Power Circuit Breaker Switchgear", provides guidance in evaluating switching devices, other than low-voltage power circuit breakers conforming to IEEE C37.13. It was developed to aid in the design, use and installation of power circuit breaker switchgear operating at 600 V ac or less, which are used in motor control and other repetitive-duty applications. For more: standards.ieee.org/announcements/pr_lowvoltagedevices.html

10. THE INDEFATIGABLE INVENTOR
The author of "The Indefatigable Inventor," Charles S. "Bert" Fowler, provides a comical look at the field of engineering, the people in it, and their intuitive minds on and off the job in this month's issue of "IEEE Spectrum" (v. 43, no. 7). From the evolution of the word "nerd," to suggesting several inventions that are just part of an engineer's job to "serve mankind," this article dives into engineering culture and discusses dream inventions such as "The Headache Generator" and "The Dirty Clothes Compactor." Visit: www.spectrum.ieee.org/jul06/4096

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WHAT'S NEW @ IEEE IN CIRCUITS
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Managing Editor: John Platt j.platt@ieee.org

Contributing Editors: Diana Fuksin, Robert J. Howe, Brian Pedersen, Ryan Thomas, Cari Wolfert

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