What's New @ IEEE in Circuits

VOLUME 4 NUMBER 8 AUGUST 2003

CONTENTS:
1. Computer-Aided Design Conference Breaks Paper Submission Record
2. Chip Foundry to Go It Alone
3. Solid-State Circuits Conference Calls for Papers
4. Product Safety Engineering Becomes 38th IEEE Society in 2004
5. Two Companies Show Off New Low-Latency DIMMs
6. Technical and Practical Addressed in New RF Title
7. National Engineers Week Calls for "New Faces of Engineering"
8. Sensors Conference Proceedings Covers Diversity of Topics
9. Chip Sales Rise in Second Quarter
10. Workplace Success: Enhancing Communications Skills
11. Smart Buildings: IEEE Spectrum Reports

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1. COMPUTER-AIDED DESIGN CONFERENCE BREAKS PAPER SUBMISSION RECORD
The International Conference on Computer-Aided Design (ICCAD) reports that it experienced a surge in paper submissions for the 2003 conference. Conference organizers say this is thanks to a decision to broaden the scope of the conference to include innovative design technologies for devices, circuits and systems. Four hundred ninety papers were submitted and 129 were accepted. The meeting is scheduled for 9 to 13 November in San Jose, California, USA. Known as the top technical forum in the Computer-Aided Design (CAD) community, ICCAD is co-sponsored by IEEE. Find out more about the conference at: www.iccad.com/

2. CHIP FOUNDRY TO GO IT ALONE
In a move counter to industry trends, chip foundry United Microelectronics Corp has decided to take a solo run at process development for the 65-nanmeter process node, according to a company executive. Most IDM foundries have been collaborating in this process. Read more at: www.eet.com/semi/news/OEG20030807S0012

3. SOLID-STATE CIRCUITS CONFERENCE CALLS FOR PAPERS
The 2004 International Solid-State Circuits Conference (ISSCC) has put out a call for papers on analog, digital, memory, imager, signal processing and wireless circuit design. The submission deadline is 8 September 2003, with the conference scheduled for 14 to 19 February in San Francisco, California, USA. Sponsored by the IEEE Solid-State Circuits Society, ISSCC is a global forum for presentation of advances in solid-state circuits and systems-on-a-chip. Find out more at: www.isscc.org/isscc/2004/authors.htm

Don't miss the next conference you need for your career. IEEE sponsors more than 300 technical conferences and workshops each year, highlighting the latest technological advances. Find events through the IEEE ConferenceSearch Web site at: http://www.ieee.org/conferencesearch/

4. PRODUCT SAFETY ENGINEERING BECOMES 38TH IEEE SOCIETY IN 2004
The IEEE Product Safety Engineering Society becomes the 38th IEEE society in 2004. The new society will focus on safety engineering for equipment and devices in the scientific, engineering, industrial, commercial and residential arenas. Members interested in joining the IEEE Product Safety Engineering Society are eligible to do so during the 2004 renewal period beginning 1 October. More information on the society will be available soon. For more on the other 37 IEEE societies, visit: www.ieee.org/organizations/tab/society.html

5. TWO COMPANIES SHOW OFF NEW LOW-LATENCY DIMMS
Two different manufacturers of DRAM modules unveiled their own nonstandard, low-latency DIMMs for streaming video that they say allow servers to read and write to memory in fewer clock cycles than the standard-latency DIMM -- up to 2.1 Gbytes/s. Smart Modular Technologies Inc. and Kingston Technology Co. both separately developed their own 2.2.2 PC2100 server DIMMs that meet the new low-latency specification. Read more: www.eet.com/semi/news/OEG20030801S0051

6. TECHNICAL AND PRACTICAL ADDRESSED IN NEW RF TITLE
Mobile communication has become a touchtone of living in the modern world, and solutions to sending signals over radio frequencies (RFs) are more important than ever. In "Practical Radio-Frequency System Design," a new book from Wiley-IEEE Press, author William F. Egan attempts to cross the technical with the practical to answer questions of both the practicing engineer and the aspiring technical professional. Find out more about this title at: www.wiley.com/remtitleinternational.cgi?isbn=0471200239
***IEEE members receive a 15% discount on Wiley-IEEE Press titles. Use code 18493 at checkout***

7. NATIONAL ENGINEERS WEEK CALLS FOR "NEW FACES OF ENGINEERING"
Earlier this year, National Engineers Week 2003 co-chairs ASHRAE and Lockheed Martin launched the "New Faces of Engineering" program to showcase talented, young engineers two to five years out of school doing interesting, unusual or extraordinary work. The program culminated with a full-page ad featuring the top individuals in USA Today during National Engineers Week. "New Faces" continues in 2004, with the IEEE serving as lead society for National Engineers Week (22 to 28 February). IEEE members are encouraged to nominate fellow members who fit the "New Faces" profile by 5 September. To nominate a colleague, download the nomination form at: www.ieeeusa.org/eweek

8. SENSORS CONFERENCE PROCEEDINGS COVERS DIVERSITY OF TOPICS
Covering some of the most important issues in the field of solid-state circuitry, the newly published proceedings of the 2003 IEEE International Solid-State Sensors, Actuators and Microsystems (Transducers) Conference address a diversity of topics ranging from fluidic manipulation systems, on-chip power and chemical sensors to accelerometers, in-vivo biosensors, gas sensing systems and microrobotic actuators. The proceedings are now available from the IEEE Online Catalog & Store: shop.ieee.org/store/product.asp?prodno=TH8664
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9. CHIP SALES RISE IN SECOND QUARTER
According to the Semiconductor Industry Association, sales of semiconductors rose 10.4 percent in the second quarter of 2003. Sales reached US$37.6 billion, compared to US$34.1 billion during the same period last year. This, says the trade group, along with a 3.2 percent increase over the first quarter, may indicate a broad-based market recovery that is in line with previous industry forecasts. Read more at: www.reuters.com/newsArticle.jhtml?type=technologyNews&storyID=3216360

10. WORKPLACE SUCCESS: ENHANCING COMMUNICATIONS SKILLS
Being able to work effectively with others is essential to any job. While most people want to work well with colleagues, many don't know how. Career counselor Larry Gaffin provides some tips for identifying and closing workplace gaps, and communicating effectively to achieve workplace success. In the July edition of IEEE-USA Today's Engineer: www.todaysengineer.org/July03/success.asp

11. SMART BUILDINGS: IEEE SPECTRUM REPORTS
The quick response to the September 11 attack on the Pentagon illustrated how effective an integrated, networked system of sensors and controls can be in responding to a disaster, limiting damage and saving lives. In this month's issue of IEEE Spectrum, Architectural Record senior editor Deborah Snoonian looks at smart buildings, discussing communication protocols such as BACNet and LonWorks, and systems being devised that use Microsoft .NET. According to Snoonian, they will be the key to making ordinary office buildings, apartment complexes, hospitals and hotels as smart, safe, and efficient as the Pentagon is today. Read more:
www.spectrum.ieee.org/WEBONLY/publicfeature/aug03/smar.html

Editors from IEEE Spectrum will deliver two education panels at the Intel Developers Forum, 16 to 18 September in San Jose, CA. IEEE members attending the Forum can receive a special registration discount when they use price code NTIEEE. Visit: http://www.intel.com/idf/us

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WHAT'S NEW @ IEEE IN CIRCUITS is a monthly, opt-in email update designed to provide you with the latest news regarding IEEE activities, industry trends, career development tips, and new IEEE product releases. We welcome your feedback on this service.

Managing Editor: John Platt j.platt@ieee.org
Editor: Lyle Smith l.smith@ieee.org

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