EDS Class of 2005 Fellows

On December 5, 2005 at the Plenary session of the IEEE EDS International Electron Devices Meeting (IEDM) in Washington, D.C., the 2005 EDS President, Hiroshi Iwai, presented a number of 2005 IEEE/EDS Fellows with certificates to congratulate them on being elected IEEE Fellows. Fourteen of the 40 EDS members elected to the IEEE grade of Fellow for 2005 attended the presentation.
40 EDS Members Elected to the IEEE Grade of Fellow
Effective 1 January 2005
|
Supriyo Bandyopadhyay, Virginia Comonwealth Univ., Richmond, VA, USA Henri Marius Baudrand, Ecole Nationale Supérieure d'Electrotechnique, Toulouse, France Robert Christopher Baumann, Texas Instruments, Dallas, Texas, USA Duane S. Boning, MIT, Cambridge, MA, USA William D. Brown, University of Arkansas, Fayetteville, AR, USA top of page
Jeff D. Bude, Agere Systems, New Providence, NJ, USAfor contributions to the deep submicron MOSFETs Robert S. Chau, Intel Corporation, Beaverton, OR, USA Clifton G. Fonstad, Massachusetts Inst. of Technology, Cambridge, MA, USA William Robert Frensley, University of Texas at Dallas, Richardson, TX, USA Guido V. Groeseneken, IMEC, Leuven, Belgium top of page
Ken-ya Hashimoto, Chiba University, Chiba, Japan George L Heiter, Heiter Microwave Consulting, Westford, MA, USA G. Benjamin Hocker, Honeywell Laboratories (Retired), Minnetonka, MN, USA James Albert Hutchby, Semiconductor Research Corp., Triangle Park, NC, USA Tadao Ishibashi, NTT Electronics Corporation, Kanagawa, Japan top of page
Noble M. Johnson, Palo Alto Research Cneter, Palo Alto, CA, USA Masaaki Kuzuhara, NEC Corporation, Otsu, Shiga Prefecture, Japan Joy Laskar, Georgia Institute of Technology, Atlanta, GA, USA Kartikeya Mayaram, Oregon State Univ, Corvallis, OR, USA Deirdre R. Meldrum, University of Washington, Seattle, Washington, USA top of page
John Melngailis, University of Maryland, College Park, MD, USA Hisayo Sasaki Momose, Toshiba Corporation, Kanagawa, Japan Mehrdad M. Moslehi, Semizone Inc., Palo Alto, CA, USA Laurence W. Nagel, Omega Enterprises, Randolph, NJ, USA Hidehito Obayashi, Hitachi High-Technologies Corporation, Ibaraki, Japan Yutaka Ohmori, Osaka University, Osaka, Japan top of page
Shinji Okazaki, Assoc. of Super-Advanced Elec. Technologies, Tokyo, Japan Manijeh Razeghi, Northwestern University, Evanston, IL, USA Mark Stephen Rodder, Texas Instruments, Dallas, TX, USA Enrico James Sangiorgi, University of Bologna, Cesna, Italy Phillip Miles Smith, BAE Sytems, Nashua, NH, USA top of page
Tangali S. Sudarshan, Univ. of South Carolina, Columbia, SC, USA Hidehiko Tanaka, University of Tokyo, Tokyo, Japan Juzer M. Vasi, Indian Institute of Technology (IIT) Bombay, Mumbai, India Sophie V. Verdonckt-Vandebroek, Xerox Corporation, Webster, NY, USA Lois D. Walsh, Air Force Research Lab, Rome, NY, USA top of page
Kevin John Webb, Purdue University, West Lafayette, IN, USA Jason Chik-Shun Woo, UCLA, Los Angeles, CA, USA Donald Coolidge Wunsch,University of Missouri - Rolla, Rolla, MO, USA Kazuo Yano, Central Research Laboratory, Hitachi, Ltd., Tokyo, Japan top of page
|


