Electron Device Letters (EDL) Editorial Board
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| Analog and Mixed- Signal Technology |
CMOS Integration and Interconnect |
Compound Semiconductor Devices |
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| Constantin Bulucea National Semiconductor Corporation 2900 Semiconductor Drive, MS E-155 Santa Clara, CA 95052-8090, USA Tel: +1 408 721 4140 Fax: +1 408 721 5100 E-Mail: constantin.bulucea@nsc.com |
Seiichiro Kawamura Selete AIST Tsukuba West 7, Tsukuba 305-8569 Japan Tel: +81 3 3460 4536 Fax: +81 3 3460 2031 E-Mail: kawamura-seiichiro@nifty.com |
Jesus A. del Alamo Massachusetts Institute of Technology Dept. of Electrical Engineering and Computer Science 77 Massachusetts Ave, Room 39-567 Cambridge , MA 02139-4307, USA Tel: +1 617 253 4764 Fax: +1 617 258 7393 E-Mail: alamo@mit.edu |
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| Compound Semiconductor Devices |
Device Modeling | High Power/Temperature Electronics and Sensors |
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| Gaudenzio Meneghesso University of Padova Department of Information Engineering Via Gradenigo 6/B I-35131 Padova, Italy Tel: +39 049 827 7653 Fax: +39 049 827 7699 E-Mail: gauss@dei.unipd.it or gaudenzio.meneghesso@unipd.it |
Xing Zhou Nanyang Technological University School of Electrical and Electronic Engineering Block S1, Room S1-B1c-95 50 Nanyang Avenue Singapore 639798 Tel: +65 6790 4532 Fax: +65 6793 3318 E-Mail: exzhou@ntu.edu.sg |
Sei-Hyung Ryu Cree, Inc. 4600 Silicon Drive Durham, NC 27703, USA Tel: +1 919 313 55s41 Fax: +1 919 313 5696 E-Mail: sei-hyung_ryu@cree.com |
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| Integrated Circuits and ESD Protection |
Optoelectronics |
Optoelectronics | ||||||
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| Albert Z. H. Wang University of California, Riverside Department of Electrical Engineering 417 Engineering Building II Riverside, CA 92521, USA Tel: +1 951 827 2555 Fax: +1 951 827 2425 Email: aw@ee.ucr.edu |
Chennupati Jagadish The Australian National University Research School of Physical Sciences and Engineering Canberra, ACT 0200, Australia Tel: +61 2 6125 0363 Fax: +61 2 6125 0511 Email: C.Jagadish@ieee.org |
Paul K.-L. Yu
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| Power and Thin-Film Devices |
Sensor and Thin Film Transistors |
Silicon Device Characterization and Modeling |
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| Johnny K.O. Sin The Hong Kong University of Science & Technology Department of Electrical & Electronic Engineering Clear Water Bay, Kowloon, Hong Kong Tel: +852 2358 7052 Fax: +852 2358 1485 E-Mail: eesin@ust.hk |
Arokia Nathan London Centre for Nanotechnology University College London London WC1H 0AH, United Kingdom Tel: +44 20 7679 2367 Fax: +44 20 7679 0595 Email: anathan@ucl.ac.uk |
Kristin De Meyer IMEC University Relations Kapeldreef 75, B-3001 Leuven, Belgium Tel: +32 16 281 322 Fax: +32 16 281 706 E-Mail: Kristin.Demeyer@imec.be |
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| Silicon Device Characterization and Modeling |
Silicon Devices and Integration |
Silicon Device and Process Integration |
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| Enrico Sangiorgi Universita di Bologna II Facolta di Ingegneria -DEIS Via Fontanelle 40 I-47100 Forli, Italy Tel: +39 0543 374418 Fax: +39 0543 374477 E-Mail: esangiorgi@deis.unibo.it |
Amitava Chatterjee Texas Instruments, Inc. DMOS5-South, MS 364 13121 TI Boulevard Dallas, TX 75243, USA Tel: +1 972 995 2972 Fax +1 972 995 2037 E-Mail: a-chatterjee@ti.com |
Chorng-Ping Chang Applied Materials, Inc. 3225 Oakmead Village Drive, M/S 1252 Santa Clara, CA 95054, USA Tel: +1 408 563 4434 Fax: +1 408 563 5670 E-Mail: cpchang@ieee.org |
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| Silicon Devices and Technology |
Silicon Device and Technology |
Silicon Devices and Technology |
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| Jin Cai IBM T.J. Watson Research Center 1101 Kitchawan Road, Route 134 P.O. Box 218 Yorktown Heights, NY 10598, USA Tel: +1 914 945 2310 Fax: +1 914 945 2141 E-Mail: jincai@us.ibm.com |
Mikael Ostling KTH, Royal Institute of Technology School of Information and Communication Technology, E229 SE-164 40 Kista, Sweden Tel: +46 8 790 4301 Fax: +46 8 752 7850 E-Mail: ostling@kth.se |
Tahui Wang National Chiao Tung University Dept. of Electronics Engineering Engineering Bldg. 4, Room 532 1001 University Road Hsinchu 300, Taiwan, ROC Tel: +886 933803877 Fax: +886 3 5724361 E-Mail: twang@cc.nctu.edu.tw |
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