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The Society focuses on the scientific, engineering, and production aspects of materials, component parts, modules, hybrids and microelectronic systems for all electronic applications. This includes the technology, selection, modeling and simulation, characterization, application, assembly, interconnection, packaging, handling, thermal management, reliability, testing and control of the above as they apply in design and manufacturing. Examples are the packaging of optoelectronics and bioelectronic systems, as well as the adaptation for operation in severe and harsh environments. Emphasis is placed upon research, analysis, development and application and manufacturing technology that aid in advancing the state-of-art within this scope. The IEEE Components Packaging, and Manufacturing Technology Society has 35 chapters and members in 49 countries worldwide. Their 15 conferences include the International Electronics Manufacturing Technology (IEMT) Symposium and the International Conference on Electronic Materials & Packaging. - Society Newsletter |
