Jack Balde Oral History
(Page numbers refer to pages in the printed
transcript held at the IEEE History
Center. On-line, they should be used as relative measures)
| 1 |
Early
academic training
Working at
Western Electric |
| 2 |
Tantalum
thin films |
| 3 |
Standardization of package for
semi-conductors |
| 4 |
ECTC
(Electronic Components and Technology
Conference) |
| 5 |
Multi-chip modules |
| 6 |
Committee structure of ECTC |
| 7 |
Denver
Multichip Module Conference |
| 8 |
Materials Research Conference |
| 9 |
CPMT
conference activities |
| 10 |
VLSI
(Very Large Scale Integrated
<devices>) Conference |
| 11 |
IEEE
Computer Society - Computer Packaging
Committee |
| 12 |
Election
of officers |
| 13 |
Multichip Module Conference |
| 14 |
Simultaneous Sessions at ECTC |
