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On 4 -5 August 2007 the
IEEE hosted a Teacher In-Service
Program (TISP) training workshop for
student branch members in Region 9.
The event was held at the Universidad
de Piura in Piura, Peru. It was held
for student branch members
interested in working with their
schools and school systems and in
helping increase the level of
technological literacy of local
pre-university educators and their
students.
The overall goals of this event were
to:
- Empower Section
“champions” to develop
collaborations with their local
pre-university community to
promote applied inquiry-based
learning
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- Enhance the level of
technological literacy
of pre-university
educators
- Encourage
pre-university students to
pursue technical
careers, including
engineering
- Increase the general
level of technological
literacy of
pre-university students for
many years
- Increase the level of
understanding of the needs of
educators among the engineering
community
- Identify ways that engineers
can assist education departments
In TISP IEEE volunteers develop and
present technologically oriented
subject matter to educators in a
professional development (or
“in-service”) setting.
In the last four years, IEEE volunteers
have made 57+ presentations to more than
1500 pre-university educators within
four Regions in the United States,
Malaysia and South Africa.
During an actual Teacher In-Service
Presentation, IEEE volunteers provide
teachers with activity materials and
then help the teachers as they work
their way through the activity. By
helping the teachers as they
work their way through a
technical activity, the teachers get
to the point where they feel
comfortable enough to present it on
their own. The idea is for the
teachers to return to their schools
and lead the same activity in their
classrooms.
About IEEE
The IEEE (Institute of Electrical
and Electronics Engineers, Inc.) is
the world’s largest technical
professional society with over
370,000 members in approximately 160
countries. Through its members, the
IEEE is a leading authority on areas
ranging from aerospace, computers and
telecommunications to biomedicine,
electric power and consumer electronics.
Electronic copies of materials
distributed at the event can be found
below.
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