Ian A. Young revolutionized the design of microprocessor clocking circuitry by designing Phase Locked Loop (or PLL) clocking circuits that drove the performance of Intel Pentium and Intel Core processors from 50 MHz to over 3 GHz. This innovation contributed to the rapid increase in the speed performance of microprocessors through the 1990s while following Moore’s Law scaling. PLL clocking circuits are among the most-used analog components within microprocessor integrated circuit products. As a manager of SRAM design and analog circuit design teams, Young developed a “Process Development & Circuit Design Co-optimization Methodology” to optimize the microprocessor performance, process density, and yield. This co-optimization methodology has become a standard across the semiconductor industry to date.
An IEEE Life Fellow, Young is a senior fellow and Director of Exploratory Integrated Circuits at Intel Corporation, Hillsboro, OR, USA.
Gary L. Patton’s innovative leadership methods and pioneering contributions have resulted in the development and implementation of semiconductor products that have impacted applications ranging from consumer handheld devices to high-performance servers. Over the past 30 years, he has driven the industry’s semiconductor roadmap through senior leadership positions within IBM and GLOBALFOUNDRIES where he led the development of leading-edge technologies. Among his many technical leadership achievements, Patton drove the introduction of high-performance embedded DRAM into IBM processors at 45nm as well as led the development of the IBM Alliance’s 32/28nm high-k technologies currently used today in a wide range of consumer and industrial applications. His pioneering work on SiGe heterojunction bipolar transistors built the foundation for today’s semiconductor components used in cell phones, wireless networks, and global positioning system devices.
An IEEE Fellow, Patton is Chief Technology Officer and Senior Vice President of Worldwide Research and Development with GLOBALFOUNDRIES, Malta, NY, USA.
Kelin J. Kuhn’s leadership in turning next-generation complimentary metal-oxide semiconductor (CMOS) technology into reality has been critical to enabling the continued miniaturization of transistors required for smaller but more powerful and efficient electronic devices. While working for Intel, Kuhn was responsible for navigating CMOS technology from minimum dimensions of 130 nm to 22 nm. Her involvement with introducing the high-k/metal-gate process was a breakthrough that enabled increased performance with lower power dissipation in electronic devices. She also made significant contributions to enabling the mass production of the TriGate transistor, which facilitates lower operating voltage for a substantial reduction in chip power consumption. These innovations are considered two of the most transformative changes in the history of silicon-based technology.
An IEEE Fellow, Kuhn is a professor with the Materials Science and Engineering Department at Cornell University, Ithaca, NY, USA.
One of the pioneers of consumer micro-electro-mechanical systems (MEMS), Benedetto Vigna is a key technology driver of the tiny sensors and actuators that have revolutionized the portable electronics landscape. Dr. Vigna’s foundational work on accelerometers and gyroscopes has paved the way for over 170 patents representing MEMS technology. In 1995, Dr. Vigna joined STMicroelectronics’ R&D Labs and launched the company’s efforts in MEMS, leading the company’s development of groundbreaking MEMS products that transformed computer gaming and enabled smartphones, tablets, and whole new industries that rely on small, affordable, and easy-to-use sensing. Called “The Man Behind the Chip Behind the Wii” in 2007 by IEEE Spectrum, Dr. Vigna and his MEMS group quickly elevated STMicroelectronics to one of the leaders in consumer MEMS technology.
An IEEE member, Dr. Vigna is currently executive vice president and general manager of the Analog, MEMS & Sensors Group, STMicroelectronics, Geneva, Switzerland.
The creativity, vision, and technical expertise of Henry T. Nicholas, III drove one of the most successful producers of communications semiconductor technology to bring broadband connectivity to the masses. Working out of out a spare room in his apartment with a $5,000 investment, Dr. Nicholas cofounded Broadcom Corporation with Dr. Henry Samueli in 1991. Under Dr. Nicholas’s direction, Broadcom pioneered the broadband communications semiconductor industry by being the first to introduce semiconductor solutions for broadband access over cable TV networks. He created and drove an environment that thrived on and rewarded invention, resulting in products such as Gigabit Ethernet, 802.11g WiFi, and digital cable modems. Broadcom continues as a leader of products that seamlessly provide multimedia connectivity in home, office, and mobile environments.
An IEEE Member, Dr. Nicholas retired from Broadcom in 2002. He currently resides in Newport, CA, USA.
William M. Holt has established a reputation at Intel Corporation for developing innovative advanced logic technologies and guiding them to high-volume production before industry competitors. With expertise that spans chip design, software, factory automation, and wafer testing, Mr. Holt has fostered a research, development, and manufacturing environment that encourages risk-taking but still delivers on time. Under Mr. Holt’s direction, Intel has rolled out six generations of new process technology, with each generation improving performance, lowering power consumption, and reducing cost per transistor. To help Intel bring its leading-edge technology to market as early as possible, Mr. Holt has to ensure internal cooperation among the groups he manages, which represent over 40,000 employees. Mr. Holt has been instrumental in leading the development of industry firsts such as the use of strained silicon to improve carrier mobility, high-k dielectrics combined with metal gates, and tri-gate transistors on 22-nm technology.
William Holt is currently Senior Vice President and General Manager of Intel Corporation’s Technology and Manufacturing Group, Hillsboro, OR, USA.
Chih-Yuan Lu’s strong leadership in developing semiconductor technology has established Taiwan as a major contributor to the industry. An expert in electron devices and integrated circuits, Dr. Lu spearheaded Taiwan’s ambitious R&D project, the National Submicron Project, which transformed the country in less than five years into a leading contributor in the world semiconductor industry. Dr. Lu co-founded Vanguard International Semiconductor in 1994 and founded Ardentec in 1999. He joined Macronix International in 1999 and led that company to become one of the most profitable memory companies in the world and also a major contributor of innovative nonvolatile memory technology. Overall, Dr. Lu has demonstrated the impact high-technology development can have on the economic development of a country such as Taiwan.
An IEEE Fellow, Dr. Lu is currently president of Macronix International Corporation, Ltd. and chairman of Ardentec Corporation, both in Hsinchu, Taiwan.
Dim-Lee Kwong’s vision, technical knowledge, and leadership have transformed the Singapore Institute of Microelectronics (IME) into a world-class research organization. IME’s executive director since 2005, Dr. Kwong has bolstered the reputation of IME’s nanoelectronics, microelectromechanical systems, silicon photonics, bioelectronics, and miniaturized medical devices programs. His strategic collaborative partnerships formed with multinational companies have injected new knowledge into the microelectronics industry. IME’s Silicon Photonics Program is one of the many programs successfully developed under Dr. Kwong. Launched in 2006, it established a cost-effective silicon photonic technology platform offering a photonics-ready, cost-shared silicon foundry service, attracting international companies and universities wanting to prototype their products. Dr. Kwong spearheaded a three-party R&D foundry business model in which IME provides access to foundry-compatible services and small-scale pilot production capabilities and works closely with wafer foundries and packaging houses. This provides a bridge to high-volume production to accelerate “More than Moore” industry development.
Prior to joining IME, Dr. Kwong was the Earl N. and Margaret Bransfield Endowed Professor at the University of Texas, Austin. An IEEE Fellow, Dr. Kwong is currently the executive director of the Institute of Microelectronics, Singapore and a professor at the National University of Singapore.
The leadership and strategic vision of John E. Kelly III has led IBM to major technology breakthroughs and partnerships. Among the many innovations developed under Dr. Kelly’s guidance, IBM introduced “copper back end of line,” rolled out 300-nanometer wafer scale and brought silicon-on-insulator technology to the high-performance microprocessor market. His unification efforts within IBM streamlined the process of bringing research and development concepts to manufacturing and commercialization. Dr. Kelly’s passion for semiconductor technology was also instrumental in creating an industry–public sector alliance that resulted in the Center of Excellence in Nanoelectronics and Nanotechnology and the NanoTech Complex at the College of Nanoscale Science and Engineering in Albany, N.Y. The NanoTech Complex is a first-of-its-kind education paradigm providing unique opportunities for students while supporting the workforce needs of the semiconductor industry.
An IEEE Fellow, Dr. Kelly is currently senior vice president and director of research at IBM Research, Yorktown Heights, NY, USA.
Shojiro Asai's contributions in electron device technologies helped position Hitachi Ltd. as a leader in the semiconductor field and benefited the industry as a whole. Dr. Asai was a leader in the development of sub-micon MOS devices. The 2-D numerical simulator for carrier transport his team built for this purpose was a world benchmark during the 1970s. He was instrumental in the development of electron beam mask making and direct writing, now indispensible tools for semiconductor manufacturing. He also led the efforts in dynamic random access memories with 3-D memory cells and microcontrollers with embedded nonvolatile memories and digital signal processor capabilities. These are now key components in computers, cell phones and personal navigators.
Dr. Asai was a key leader in developing low-cost, tamper-resistant radio frequency identification (RF-ID) technology. It provides the ability to trace industrial and commercial goods throughout the entire product lifecycle. An IEEE Life Fellow, Dr. Asai is currently executive vice president of Rigaku Corporation, Tokyo, Japan.
Gilbert J. Declerck, co-founder, president and CEO of the Interuniversity Microelectronics Center (IMEC), Leuven, Belgium, is credited with developing IMEC into one of the world's most advanced semiconductor research centers. Under his guidance, IMEC has created a unique alliance with the top integrated device manufacturers, foundries, system houses, fables and fab-lite companies and researchers in academia and industry. Dr. Declerck's leadership has continued the expansion of IMEC's R&D capabilities into cutting edge transistor scaling beyond the 32nm node. Today IMEC is recognized worldwide and runs several industrial affiliation programs with global participation in the fields of semiconductor technology, system-on-chip design, heterogeneous integration and advanced packaging technologies. Dr. Declerck's success in bringing together preeminent researchers in semiconductors and other fields, including nanotechnology, has earned him numerous appointments to several advisory boards of scientific organizations and companies. An IEEE Fellow, Dr. Declerck has authored and co-authored more than 200 papers.
Kenneth Lee is senior advisor and former president and chief executive officer of KT Corporation (Korea Telecom) in Seoul, Korea, and a visiting professor at the KAIST Graduate School of Information and Media Management, Seoul, Korea.
KT Group developed one of the most extensive wired and wireless broadband access networks in the world and the world's largest broadband operator by 2003 with over five million subscribers. He also led KT to develop the first Korean voice recognition system, the first commercial CDMA Personal Communications System and a series of broadband access services from DSL to fiber LAN.
When Dr. Lee was the CEO of KTF, a mobile service subsidiary of KT Corp., he was the industry leader in CDMA 3G services by deploying CDMA2000 1x and CDMA2000 1xEV-DO in 2002 - enabling high-speed wireless connectivity comparable to wired broadband.
Dr. Lee is an IEEE Member and a member of Eta Kappa Nu and the National Academy of Engineering in Korea. He received the Industrial Medal (Gold) from the Korean Government in 2005 and the Forbes Magazine's Management Leadership Award in 2004.
Louis C. Parrillo is an exceptional technical and business leader with the vision to lead technology companies in important new and strategic directions..
At Bell Laboratories in Murray Hill, NJ, Dr. Parrillo and his colleagues developed the company’s first all-implanted, high-speed bipolar technology, including solutions to yield-limiting mechanisms that the industry widely adopted. With Dr. Richard Payne, he developed Twin Tub CMOS technology, which produced the world’s first 32-bit CMOS microprocessor. The original and subsequent generations of Twin Tub CMOS became an industry standard for high performance CMOS.
As leader of Motorola’s Advanced Products Research and Development Lab (APRDL) in Austin, Texas he pursued his vision of creating a mini Bell Labs in a business environment by strengthening the organization technically and linking its activities to the businesses and manufacturing.
Working with TRW, he led Motorola’s efforts to produce the world’s largest and most advanced Superchips, successfully completing the U.S. Government’s CMOS Very High Speed Integrated Circuit (VHSIC) program.
He drove the creation of Motorola’s Dan Noble Center, enabling the company to make leading-edge Power-PC products and laying the groundwork for several external technology alliances. As a division general manager he drove the development and market introduction of ultra-fast SRAM products, at the time the fastest and most compact, as well as the first to use copper interconnect technology.
As Semiconductor CTO, he and his colleagues led the partnership among Motorola, ST Microelectronics, Philips Semiconductor and TSMC for 300mm-wafer research in Crolles, France. Such a partnership lowered the cost and risk of 300mm technology development, enabling Motorola with ongoing, technological advances to benefit their customers worldwide.
Dr. Parrillo retired in 2003 from Motorola and is now president of Parrillo Consulting, LLC in Austin, Texas, where he provides technical, managerial and business expertise to a diverse group of clients.
An IEEE Fellow, he is a past president of the IEEE Electron Devices Society, received the society’s J.J.Ebers Award and is a member of the National Academy of Engineering. He has a bachelor’s degree from the University of Connecticut at Storrs in electrical engineering, and a master of arts, a master’s in electrical engineering and a doctoral degree in electrical engineering, all from Princeton University.
A long-time pioneer in the field of semiconductor research and development, Dr. Hiroyoshi Komiya has played a critical role in building the basic technology of the semiconductor industry worldwide. He is an international leader in developing ultra-large-scale integration (ULSI) technology and its standards including 300mm technology, ArF and EB lithography. As both chairman of the Asia Task Force of the Silicon Wafer Summit and executive vice president and chief operating officer of Semiconductor Leading Edge Technologies, Inc. in Tsukuba, Japan, Dr. Komiya drove key decisions about next generation wafer size and global collaboration strategies for the transition. Dr. Komiya subsequently led cooperative research and development expected to make a significant contribution to the progress of semiconductor technology in the sub-100nm range.
An IEEE Fellow and a recipient of the IEEE Third Millennium Medal, he has served on the executive committee of the IEEE Tokyo Section.
During his 36-year tenure with British Telecom (BT) laboratories, visionary Thomas R. Rowbotham led many breakthroughs-encoded TV signals over microwave radio and satellite-switched TDMA, Blown Fiber, the semiconductor laser amplifier, the add-drop digital multiplexer at 2.4 Gbit/s, the 565 Mbit/s optical transmission system, the longest transmission between repeaters over fiber (200 kms), as recognized by the Guinness Book of World Records, and global virtual network service. As director of BT Laboratories, he began an outreach program, promoting stronger collaboration and communication among competing telecommunications laboratories around the world. Subsequently, many multi-company initiatives in the fields of open networks and local loop technology were created.
An IEEE Senior Member, Dr. Rowbotham has served as IEEE Division III (Communications Technology) director and on the IEEE Communications Society and IEEE Foundation boards. He is a Fellow of the IEE and the Royal Academy of Engineering, and is a venture partner with St. Paul Venture Capital in Westboro, Mass.
Dr. Toshiharu Aoki, president and CEO of NTT Data Corporation, has helped to shape the integrated digital network in Japan through major communications developments, including coding theory, digital-over-analog transmission systems and switching systems. He also has led the Telecommunication Information Networking Architecture Consortium, a global research and development group; the Full Service Access Network, an international fiber optic access standards body; and many efforts that have pioneered the development of multimedia services in Japan. He is an IEEE and Institute of Electronics, Information and Communications Engineers (IEICE) Fellow. Dr. Aoki has served as president of IEICE and on the Industry Technology Committee of the Japan Federation of Economic Organizations.
His honors include the Post & Telecom Association of Japan's Maejima Award, the IEICE Achievement Award and the IEICE Yonezawa Memorial Young Engineer Award.