Below are the candidates for 2023 IEEE Technical Activities Vice President-Elect.

The sequence of candidates was determined by lottery and indicates no preference.

  • Manfred "Fred" J. Schindler (Nominated by IEEE Technical Activities)
  • Rakesh Kumar (Nominated by IEEE Technical Activities)

View position description


Manfred “Fred” J. Schindler

Headshot of Manfred Schindler

Manfred “Fred” J. Schindler 
(Nominated by IEEE Technical Activities)

Newtonville, Massachusetts, USA

Meet Fred by watching a brief video.

Fred Schindler has focused on the development of microwave semiconductor circuits and technology, and managing engineering organizations, in a career spanning the nascent development of GaAs MMIC technology through the production of high-volume commercial products. He currently works as an independent consultant, supporting clients with technical expertise, due diligence, and project management. He also serves as Chief Technology Officer for Anlotek Ltd, an innovative RF technology company. He previously served as Director of RFMD/Qorvo’s Boston Design Center, Applications Manager for IBM Microelectronics Wireless Products, Engineering Manager at ATN Microwave, and Microwave Circuits Research Lab Manager at Raytheon. He earned the MSECE at UMass Amherst in 1982 as a Raytheon Microwave Scholar and the BSEE from the Columbia University SEAS in New York. He holds 11 patents and has published over 40 technical articles. He has contributed a column on Microwave Business to IEEE Microwave Magazine since 2011.



TAB is comprised of 46 Societies and Councils, each with its own traditions and practices. These are our communities. The challenge for TAB is to support the independent spirit of our Societies and Councils, while enabling the benefits of collaboration and cooperation. We already leverage the strength of working together in areas such as our Resource Centers, DataPort, CodeOcean, TechRxiv, and the Xplore platform. We collaborate via co-sponsored journals and conferences. We’ve also seen the benefits of working together informally. The pandemic forced all of us to pivot to virtual conferences. This gave us an opportunity to learn from each other, to share what worked well and what didn’t; to leverage our joint strength. All our Societies and Councils will face challenges going forward, some common and some unique. The growth of Open Access publishing, and resulting reductions in revenues, will impact us all. We may run 46 different experiments trying to best serve our communities - we can learn and adopt those which work best. Perhaps most importantly, we need to continue to develop synergies to improve our engagement with established communities, growing communities, as well as those that are yet to come.


IEEE Accomplishments and Activities

IEEE Accomplishments:

Board of Directors

  • Division IV Director (2021-2022)
  • Member: Governance Committee (2022), EBCC (2022), Future of Engagement adhoc (2022), Constitution adhoc (2021), Election Practices adhoc (2021), Conference Financial Management adhoc, (2017-2019), Future of Information and Convening adhoc (2015), History Committee Coordinator (2021)


  • Member (2003, 2015-2018, 2021-2022). Also Chair: Society/Council Life-Cycle adhoc (2021-2022), Sections Congress adhoc (2020); Co-Chair MGA/TAB Marketing Automation adhoc (2015); Member: FinCom (2015-2018), Financial Health adhoc (2018-2019), Sections Congress adhoc (2017), Hall of Honor Committee (2018-2020), Strategic Planning Committee (2019), Contract Process adhoc (2018), TAB/PSPB Strategic adhoc (2019-2020)


  • IEEE Conferences Committee Chair (2015-2018), Member (2013-2014, 2019-2022). Also Chair: Nominations, Appointments and Recommendations (2019-2022), Conference Quality (2017), Conference Applications Review (2018-2019), Conference Portfolio Review (2018-2020), Conference Organization Integrity adhoc (2019), Event Innovations (2019). Member: Technical Program Integrity (2014-2019).
  • International Microwave Symposium, General Chair (2009). Also Chair: Organizational Model Task Force (2021-2022), ExCom (2011-2012, 2014-2015), Exhibition Management (2007-2008), PCO Search (2010-2011), Technical Program (2000), Protocol (2012); TPC Member (1995-2003, 2012-2014, 2016-2020, 2022), Advisor (2012-2016, 2019, 2023).
  • Radio and Wireless Symposium, Founding Chair (2006), ExCom Chair, (2005-2007, 2010-2015), PAWR TP Chair (2014-2016)


  • PSPB Member (2015-2018, 2020). Also Member: Publication Conduct Committee (2021-2022), SPC (2020-2021), Peer Review adhoc (2020-2021), OA Strategy adhoc (2022)
  • IEEE Transactions on Microwave Theory and Techniques, Editorial Board (1994-2000)
  • IEEE Microwave and Wireless Component Letters, Editorial Board (2000-2008)
  • IEEE Microwave Magazine, Business Issues Editor (2010-2022)

Products and Services Committee

  • Member (2020-2022)
  • Conference Publications Committee Chair (2021-2022)


  • MTT-S: President (2003), led turnaround through a time of financially stress. VP 2002, Secretary 1993, AdCom Elected Member, 1994-2002, Chair: Membership Services, (2000-2001), Meetings and Symposia, (1996-1997), Operations (1999), Budget (2002), Long Range Planning (2005), MTT-19 TC (2010-2015), Electronic Information (1994-1996), Marketing-Publicity (1995-1998), MMIC Historical Exhibit (1993-1998), Honorary Life Member (2022)
  • CRFID Advisory Committee Member (2018-2022)

Rakesh Kumar

Headshot of Rakesh Kumar

Rakesh Kumar 
(Nominated by IEEE Technical Activities)

President & CEO
Technology Connexions Inc.
Poway, California, USA

Meet Rakesh by watching a brief video.

Rakesh has a distinguished semiconductor industry career, is an entrepreneur, and an educator. He is the founder of two start-ups and has made many technical and leadership contributions at Cadence, Unisys, and Motorola.  He has developed leading semiconductor technologies.  As VP and & GM at Cadence he built a successful Silicon Technology services business championing the integration of silicon, design and EDA in chip and system design.  He enabled the Fabless industry revolution and authored McGraw Hill’s “Fabless Semiconductor Implementation”.  He is an IEEE Life Fellow, was inducted into the Technical Activities Hall of Honor.  His many IEEE contribution include Chair of the President’s Data AdHoc & Roadmaps Committees, Co-Chair of DataPort, Past-President of SSCS, TA Chair for 3 Sections Congresses.  He teaches Entrepreneurship at UC San Diego. 

He received the EE Ph.D. and M.S. from Univ. Rochester (1974, 1971), BTech. from IIT-Delhi (1969), and Executive “MBA” from UCSD (1989.)



IEEE/TA has an excellent reputation and brand for being the premier research publication/conference venue.  Society/Council’s focus have been focused in individual FOI’s.  Our revenues and membership trends have been under pressure and have prompted numerous initiatives with limited success.  By focusing on understanding and meeting Customer needs in this industry environment of accelerated Product Development cycles, I believe there are many opportunities for IEEE to grow our revenue and expand our reach to a broader community.  A focus on innovative cross-functional solutions that enable customers to introduce products more rapidly and solve climate problems by connecting overall megatrends to customer needs is a must. Using creative business and operating models we can offer novel solutions that leverage our Data, Roadmaps, Digital Transformation, and other new technologies.  With my broad Technical, business, entrepreneurial and academic experience I can bring together TA to enhance our offerings.  My key priorities:

  1. Better understand Customer needs, including Practitioners and millennials
  2. Promote cross-functional cooperation to create multidisciplinary solutions to meet customer needs
  3. Promote and drive enhancement of existing, and the creation of new Products, Events and Services to attract new members globally and improve our diversity, e.g., DataPort, IEEE app, Roadmaps, ILN, etc.


IEEE Accomplishments and Activities



Dr. Kumar has served in a wide range of leadership roles.  His efforts have led to enhancements within TA , has increased globalization and increased cooperation across various OU’s.  He was inducted into the TAB Hall of Honor.  He fosters cross-functional cooperation and innovation using his technical know-how and leadership skills.


Recent Leadership Roles:

  • Chair of IEEE Data-based Business Strategy AdHoc committee
  • Chair of IEEE Technology Roadmaps Committee
  • Co-Chair of DataPort
  • Strategy Adviser and Magazine Board Chair, SSCS
  • IEEE Sections Congress – 2020 Advisory panel, 2017, 2014, 2011 TA Chair
  • Boards of Governors – SSCS, SSIT, HKN
  •  MGA VoLT Instructor


Technical Activities Leadership:

  • TMC 2015-17
  • Strategic Planning 2014-16
  • Vice-Chair Entrepreneurship 2015-16
  • Chair Society Turnaround Committee (SSIT) 2012-14
  • MGA Geographic Unit Operations Support Committee, TAB Representative 2011
  • Ethics and Conflict Resolution 2010
  • TAB FinCom 2009-10


Society Leadership (SSCS)

  • Society Directions committee Advisor (2021-present)
  • President 2012-13; Vice-President 2010-11; Treasurer 2005-09; CICC Representative to SSCS AdCom 2000-04; Nominations Chair 2014-15; Chair, Magazine Advisory Board, 2014-present.
  • As SSCS President/President-elect, promoted outreach for global presence
    • Facilitated formation of 12 new Chapters (15% growth in 2 years)
    • Led programs that transformed declining Society membership trend to positive annual growth (~2.5%) in 2 years
    • Promoted volunteer recognition - Fellow nominations increased by 80%
    • Enhanced educational activities - >15 tutorials/short courses available online, 7 Distinguished Lecture “Tours” in Regions 8-10 (participated in 3)
    • Launched successful SSCS Webinar program
    • Distinguished Lectures on behalf of SSCS and EDS
    • Supported GOLD/YP and WIE activities
    • Championed/promoted member value
  • Spear-headed approval and launched IEEE Solid-State Circuits Magazine focused on historical, educational and newsworthy content (2005-06). Tutorials Editor for five years.
  • Used Leadership skills that drove the formulation/approval of cross-functional publications:
    • IEEE RFIC Virtual Journal – Fostered cooperation between SSC/CAS/MTT/ED/AP Societies
  • JXCDC – IEEE Journal on Exploratory Computational Solid-State Computational Devices and Circuits (sponsors SSCS/Magnetics/NanoTechC/CAS/Computer; technical co-sponsors EDS/C Superconductivity/CEDA)