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2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM)

IEEE sponsors:

  • IEEE Electron Devices Society

Asia has strong potential to take the initiative for system integration. Deep-dive discussions among industry experts on materials, processes and devices are essential to accelerate manufacturing innovations through this forum. The first conference in 2017 focuses on devices, tools, materials for IoT. Packaging and Manufacturing Technology are also discussed.

 

Conference Details

Dates

28 Feb - 02 Mar 2017

 

Location

Toyama International Conference Center
1-2 Otemachi
Toyama, Japan

 

Web site

 

Contact

Shuji Ikeda
3-30-8 Nukuikita, Koganei
Tokyo Japan 184-0015
+81-80-3586-6412
shu.ikeda@tei-solutions.com
+81-29-852-7040 (fax)

 

Conference #

40312

 

Attendance

250

 

Publications

 

 

Please see the conference Web site for full details.

Call for Papers for Conference Authors

Find details for paper and abstract submission.

Abstract submission deadline: 04 Nov 2016

Full Paper Submission deadline: 04 Nov 2016

Final submission deadline: 16 Jan 2017

Notification of acceptance date: 12 Dec 2016

 

 

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