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Letters on Electromagnetic Compatibility Practice and Applications, IEEE


IEEE Journal on Electromagnetic Compatibility Practice and Applications (J-EMCPA) is a rigorously peer-reviewed forum for rapid publication of articles describing practice, lessons learned and applications of the disciplines electromagnetic compatibility (EMC) and signal and power integrity (SIPI) as well as all relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity.

Membership in IEEE's technical Societies provides access to top-quality publications such as this one either as a member benefit or via discounted subscriptions.

Frequency: 4

Product No: PER299

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