Program bolsters continuous electronics packaging education for Society members and students pursuing electronics packaging training
Piscataway, N.J. – 23 January 2019 - IEEE, the world's largest technical professional organization dedicated to advancing technology for humanity, and the IEEE Electronics Packaging Society (IEEE EPS), today announced the introduction of a new IEEE EPS Certificate Program. Offered by the leading international forum for scientists and engineers engaged in microsystems packaging and manufacturing, the new IEEE EPS certificate program is open to all Society members, but is especially targeted at Young Professionals and Student members.
Membership in IEEE and EPS provides access to the industry's most essential technical information, networking opportunities, career-development tools, and many other exclusive benefits. These include a free online subscription to IEEE Transactions on Components, Packaging and Manufacturing Technology, online access to IEEE RFID Virtual Journal, free subscriptions to the EPS Newsletter and IEEE Spectrum magazine, discounts on key IEEE technical journals and conference resgistrations, and more.
The new certificate program provides participants with a visible way to showcase their knowledge; creates opportunities for them to develop the skills needed to further advance technology development and adoption in the electronics packaging field; and broadens their engagement in the Society. IEEE EPS Certificates are available to Society members and can be earned through the accumulation of 15 professional development hours (PDHs). Criteria for earning PDHs can be found by visiting the IEEE EPS Certificate Program web page.
“As we approach the third decade of the 21st century, with rapidly changing electronics packaging technology now a value creator and product differentiator across the electronic industry, the EPS Certificate will help distinguish the unique skills and knowledge of our members in this critical domain of science and technology,” said Avram Bar-Cohen, president, IEEE Electronics Packaging Society. “The new certificate program will help ensure that IEEE EPS members are up to date on the latest technological advancements and the practical applications found within the electronics packaging space, while opening the door to continuous education through course studies and active participation within the Society.”
EPS Packaging Vision Competition
To further expand opportunities to impact the future of electronics packaging, IEEE EPS has issued a final call for submissions to its Packaging Vision Competition, with awards to be presented at the IEEE Electronic Components and Technology Conference (ECTC) held 28–31 May 2019 at The Cosmopolitan of Las Vegas, NV, USA. The competition is open to all attendees of ECTC and The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). Learn more on how to participate by visiting the Packaging Vision Competition web page.
To learn more about IEEE EPS, please visit the Society’s home page. For more detailed information on membership benefits, please visit the IEEE EPS membership page.
About IEEE EPS
The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design, and development of revolutionary advances in microsystems packaging and manufacturing. The Society promotes close cooperation and exchange of technical information among its members and others through technical conferences and workshops, peer-reviewed publications, and collaboration with other organizations. Learn more.
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. Learn more.