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Circuits and Systems, Part I: Regular Papers, IEEE Transactions on

Contains regular papers focusing on all matters related to the fundamental theory, applications, analog and digital signal processing.

Format(s): Electronic, Electronic and Print, Print

 

Circuits and Systems, Part II: Express Briefs, IEEE Transactions on

Publishing short-length reports on the latest significant results related to the fundamental theory, applications, analog and digital signal processing.

Format(s): Electronic, Electronic and Print, Print

 

Cloud Computing, IEEE

IEEE Cloud Computing magazine is committed to the timely publication of peer-reviewed articles that provide innovative research ideas, applications results, and case studies in all areas of cloud computing.

Format(s): Digital and Electronic, Electronic

 

Cloud Computing, IEEE Transactions on

Covering innovative research ideas and applications results in all areas relating to cloud computing.

Format(s): Electronic

 

Cognitive Communications and Networking, IEEE Transactions on

The IEEE Transactions on Cognitive Communications and Networking publishes manuscripts that advance to the state-of-the-art of cognitive communications and networking research.

Format(s): Electronic

 

Communications Letters, IEEE

Covers topics in the scope of IEEE Transactions on Communications but in the form of very brief publication.

Format(s): Electronic

 

Communications Magazine, IEEE

Covers all areas of communications such as lightwave telecom, high-speed data communications, wireless/personal communications systems, ISDN, and more.

Format(s): Electronic, Electronic and Print, Print

 

Communications Surveys & Tutorials, IEEE

Each tutorial reviews currents communications topics in network management and computer and wireless communications.

Format(s): Electronic

 

Communications, IEEE Transactions on

Regarded as "the source" for breakthroughs in communications theory and applications since 1953.

Format(s): Electronic, Electronic and Print, Print

 

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Covers modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Format(s): Electronic, Electronic and Print, Print

 
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