Components, Packaging, and Manufacturing Technology, IEEE Transactions on
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on the modeling, design, test physicals, materials, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, RF and MEMS packaging and their integration in systems and constituent sub-systems (also referred to as micro-systems). New developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for- performance/manufacturability/test/security to ensure reliable performance in different application design-for-environments are within the scope of the journal. Additionally, topics that focus on heterogeneous integration of current and emerging active and passive components at the package, micro-system and system level are within the scope of this journal. This includes system and subsystem wafer and panel level integration of chiplets, packaged and bare die components and their associated physical, power delivery, signaling and signaling architectures, in a wide variety of application environments including but not limited to - HPC, IoT, automotive, networking, medical and aerospace.
Frequency: 6
ISSN: 2156-3950
Product No: PER240
