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Components, Packaging, and Manufacturing Technology, IEEE Transactions on

 
 

IEEE Transactions on Components, Packaging, and Manufacturing covers the following content areas: modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.

Membership in IEEE's technical Societies provides access to top-quality publications such as this one either as a member benefit or via discounted subscriptions. The electronic version of this journal is part of the CPMT Society membership, but all media types are also offered for purchase.


Frequency: 6

ISSN: 2156-3950

Product No: PER240

 
 
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Print
 
 
 
 
 
 
 
 
 
 
 
 
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